BEAVERTON, Ore., March 5, 2026 /PRNewswire/ -- Nanoverse Technologies Limited (NVT) announces the release of its new Advanced Packaging line of tools. NVT has recently developed the fastest, most advanced and most versatile laser singulation and metrology tools in the industry. The Advanced Packaging product family includes: 5500, 6600, 7700, and 9900 all based upon a common platform architecture for fleet-wide tool matching. The laser systems represent commercial deployment of a laser design exclusive to Nanoverse Technologies. These are the only tools in the industry offering the integration of a true metrology solution and laser scribing/dicing capability providing an industry first in true process control. NVT CEO Jeff Albelo stated that "We now offer real-time process observability coupled with advanced singulation technology for both rapid prototyping and High-Volume Manufacturing (HVM) alike. It's a game changer."

NVT 7700: Fully Automated, Recipe Driven, Factory Ready

The flagship NVT 7700, represents the perfect fusion of laser scribing with advanced metrology. The laser process delivers the highest die break strength laser process in the industry (2-3x higher than current processes)! Capable of processing up to 30 wafers per hour with < 3 mm placement accuracy, the system demonstrates a GR&R of less than 300 nm. The Model 7700 includes multiple system modules designed for completely independent and simultaneous execution of scribing, dicing, metrology, coating, cleaning, and post-coat baking of both mounted and unmounted wafers in mixed lot processing. The system software architecture enables flawless, recipe driven, automation with OHV compatibility. The laser scribing and dicing module employs a true ultrafast process capable of on the fly power adjustments. The system is completely SEMI compliant and supports both two and four load port configurations.

The NVT 6600 product family represents the same innovations targeting production environments where integrated metrology is not required and a smaller tool footprint is desirable. The NVT 6600 retains the same coat, clean, bake, scribe, and dice capability as the flagship tool, at higher throughput.

The NVT 5500 is a stand-alone metrology and inspection system utilizing a patented, phase-based, white light approach. The result is a high-speed, high-resolution metrology system capable of whole wafer scanning delivering simultaneous 2D and 3D information without image stitching. As a dedicated metrology system, the NVT 5500 detects bumps, pads, debris and defects on a wide array of substrates. The NVT technology can detect many films currently invisible to competitive systems, including non-conductive films (NCF).

Set for release in mid-2026, the NVT 9900 platform represents the next generation evolution of laser based singulation. The system includes a dual laser configuration to complete high-speed and high-quality full-cut laser scribing and dicing as part of the die prep process. The lasers can be different wavelength, pulse width, power and pulse energy to customize the laser singulation options available to our customers. Paired with or replacing plasma dicing, the NVT technology platforms represents an incredible advancement in back-end processing technology. Please visit our website www.nanovtech.com for further information or to have a chat about how we can enable your advanced packaging roadmap.

MBZUAI Launches K2 Think V2: UAE’s Fully Sovereign, Next-Generation Reasoning System

This launch marks a major milestone for the UAE's technological sovereignty. While earlier versions of K2 Think were open and widely accessible, K2 Think V2 (70B) is the first to be open from end-to-end; from pre-training data and curation through post-training, reasoning alignment, and evaluation. The result is a reasoning system that is both more transparent and more powerful.

By upgrading the base model to K2-V2, K2 Think V2 unlocks a new level of performance, openness, and independence, reinforcing the UAE's leadership in building frontier-grade AI systems that are globally accessible and fully sovereign.

Why K2 Think V2 is Different

K2 Think V2 marks a step change in open reasoning systems, shifting from a reasoning model layered on top of a foundation to one built directly into it. Inheriting K2-V2's long-context capabilities and full training transparency, it now operates as a fully sovereign system end-to-end.

Every stage of K2 Think V2 (70B) is open, inspectable, and independently reproducible, ensuring both scientific credibility and national AI sovereignty. Designed as a purpose-built reasoning system, it solves complex problems step-by-step using long chains of thought across mathematics, science, coding, logic, and simulation.

This reasoning-first, fully open foundation translates directly into greater levels of performance. K2 Think V2 delivers leading results on complex reasoning benchmarks, including AIME2025, GPQA-Diamond, HMMT, and IFBench, when compared against other open-source reasoning systems.

Key Features, Made Simple

Built on K2-V2

K2 Think V2 (70B) is powered by MBZUAI IFM's latest foundation model, designed from the outset to support reasoning, long context, and alignment, raising the ceiling for what the reasoning system can achieve.

Longer Memory, Deeper Thought

Expanded context length enables sustained, multi-step reasoning over much larger bodies of information.

Truly Independent Data Pipeline

All training relies on IFM-curated datasets, including the Guru dataset, fully decontaminated from downstream benchmarks to ensure fair and trustworthy evaluation.

360-Open Transparency

From pre-training data and intermediate checkpoints to post-training recipes and evaluations, every component is available for inspection, reuse, and extension.

For more information on K2 Think V2 (70B) or to explore the data used to build it, please visit the Institute of Foundation Models' official platform. You can also access the system and learn more through the following resources:

• Web Experience:Access the Web App
• Official Landing Page:Visit k2think.ai
• Mobile Apps:
  Download for iOS
  Download for Android
• In-Depth Details: Read the full blog post here
• Visual Overview:Watch the Promo Video                                                                                                             

For more information, please visit https://mbzuai.ac.ae/

About Cerebras

Cerebras Systems builds the fastest AI infrastructure in the world. We are a team of pioneering computer architects, computer scientists, AI researchers, and engineers. We make AI blisteringly fast through innovation and invention because we believe that when AI is fast it will change the world. Our flagship technology, the Wafer Scale Engine (WSE) is the world's largest and fastest AI processor. At 56 times larger than the largest GPU, the WSE uses a fraction of the power per unit compute while delivering inference and training more than 20 times faster than the competition. Leading corporations, research institutes and governments on five continents chose Cerebras to run their AI workloads. Cerebras solutions are available on premise and in the cloud. For further information, visit cerebras.ai or follow us on LinkedIn, X and/or Threads.

About Mohamed bin Zayed University of Artificial Intelligence

Mohamed bin Zayed University of Artificial Intelligence (MBZUAI) is the first university dedicated entirely to the advancement of science through AI. The university empowers the next generation of AI leaders, driving innovation and impactful applications of AI through world-class education and interdisciplinary research.  In 2025, MBZUAI launched its first ever undergraduate program, a Bachelor of Science in AI, with two distinct streams: Business and Engineering.

About MBZUAI's Institute of Foundation Models

The Institute of Foundation Models (IFM) at MBZUAI is dedicated to pioneering academic research at the forefront of global AI innovation, driven by real-world societal needs.

With deep scientific roots and world-class talent in Abu Dhabi, Paris, and Silicon Valley, IFM builds some of the world's most powerful foundation models - open, fast, and focused on solving real-world problems.

These include the PAN World Model, K2, a 360-open LL, and K2-Think, a leading open-source system for advanced AI reasoning. IFM engineers have contributed to the development of low-resource language LLMs in Arabic (Jais), Hindi (Nanda) and Kazakh (Sherkala).

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ -- On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming to strengthen connectivity across the semiconductor value chain and to realize Vietnam's major national orientations on mastering core and sovereign technologies, in line with Resolution No. 57-NQ/TW, Decision No. 1131/QĐ-TTg and Decision No. 1018/QĐ-TTg, thereby enabling Vietnam to move deeper into the global semiconductor supply chain. This is the first semiconductor testing and packaging plant in Vietnam fully owned and operated by Vietnamese entities, contributing to the completion of the national semiconductor ecosystem with a full spectrum of activities spanning research, design, manufacturing, training, testing and packaging, and commercialization—positioning Vietnam more prominently in the global semiconductor value chain.

The announcement ceremony was attended by representatives from the Ministry of Science and Technology, leaders of Viettel Group, leaders of FPT Corporation, representatives from enterprises, research institutes and universities, members of the Au Lac AI Alliance, the Low-Altitude Economy Alliance, and major semiconductor enterprises and partners from Vietnam, Japan, South Korea, Taiwan region, and other countries.

The announcement of the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant underscores FPT's strong commitment to implementing the Politburo's Resolution No. 57-NQ/TW on breakthroughs in science, technology, innovation, and national digital transformation; the Prime Minister's Decision No. 1131/QĐ-TTg on strategic technologies; and Decision No. 1018/QĐ-TTg approving the national strategy for semiconductor industry development, which sets the target for Vietnam to have 10 advanced testing and packaging facilities by 2030.

This initiative also represents a strategic move to harness the collective strength of the national semiconductor alliance, jointly developing and mastering core technology capabilities, and completing an integrated semiconductor ecosystem spanning research, design, manufacturing, testing, packaging, and commercialization—thereby enabling Vietnam to move further up the global semiconductor value chain.

In addition, the plant will provide hands-on training and practical learning opportunities for semiconductor students within Vietnam, contributing to the enhancement of human resource quality in the semiconductor sector and supporting the national goal of developing 50,000 semiconductor professionals by 2030, including at least 35,000 professionals in manufacturing, packaging, testing, and other key stages of the semiconductor industry.

Speaking at the event, Mr. Truong Gia Binh, Chairman of FPT Corporation, stated: "If Vietnam is to become a prosperous nation, there is no other path than mastering semiconductor technology. If we count Vietnamese professionals around the world, we are a significant force in the semiconductor industry. Our biggest challenge is to connect and build our own ecosystem. With today's event, we take another step toward completing Vietnam's semiconductor ecosystem. FPT has grown through hardship, so we always pursue practical solutions: products must be market-ready. We will closely collaborate with Viettel and domestic partners—wherever chips are manufactured, FPT will participate in testing and packaging—so that Vietnamese technology chips can soon be applied in real life".

Lieutenant General Tao Duc Thang, Member of the Party Central Committee, Chairman and CEO of Viettel, emphasized: "FPT's investment in a semiconductor testing and packaging plant holds strategic significance in completing the 'Make in Vietnam' semiconductor ecosystem, fully aligned with the spirit of Resolution No. 57-NQ/TW on breakthroughs in science, technology, innovation and national digital transformation. The testing and packaging plant, together with Viettel's chip fabrication plant scheduled to break ground in January 2026, will serve as a "hands-on" environment for training, developing, and retaining semiconductor engineers domestically, thereby helping curb brain drain and build a core workforce for this strategic industry. Viettel consistently believes that semiconductor industry development must be based on close cooperation between the state-owned and private sectors, in accordance with Resolution No. 79-NQ/TW on state-owned economic development and Resolution No. 68-NQ/TW on private sector development".

Dr. Nguyen Bich Yen, Honorary Chairwoman of the Institute of Semiconductor and Advanced Materials – Vietnam National University, Hanoi; Chairwoman of VSAP Lab and IEEE member, commented: "Vietnam is no longer merely talking about semiconductors—Vietnam is taking synchronized and serious action. Pioneer enterprises are driving progress through concrete commitments and collaboration to build a Vietnamese semiconductor value chain. Key components—from materials, design, packaging, testing and manufacturing to digital infrastructure and human resources—are gradually taking shape. In this picture, FPT stands out as a major pillar, not only enhancing technological capacity but also serving as a connector, leader and trust-builder for the entire ecosystem".

The FPT Advanced Semiconductor Testing and Packaging Plant is expected to emerge as a leading advanced testing and packaging facility in the region. In Phase 1 (2026–2027), the plant will be located at Yen Phong II-C Industrial Park, Yen Phong and Tam Giang Communes, Bac Ninh Province, with a total floor area of 1,600 square meters. The facility will be equipped with 06 functional testing lines (ATE testers and handlers) and 01 dedicated reliability and durability testing area, including Burn-in, Reliability Test, and Failure Analysis Test. All equipment systems comply with international quality management standards ISO 9001, ISO 14001, and IATF 16949, as well as specialized semiconductor technical standards such as JEDEC, AEC-Q100, and AEC-Q101, ensuring product quality, stability, and reliability throughout the entire product lifecycle.

With the capability to flexibly deliver both rapid testing and in-depth customized testing tailored to individual customer requirements, the system enables customers to optimize costs without the need to distribute quality inspection processes across multiple locations. Notably, a key competitive advantage of FPT lies in its Make-in-Vietnam testing software development, developed and fine-tuned to meet the specific requirements of different products. The completion of the six functional testing lines and the dedicated reliability and durability testing area is scheduled to coincide with celebrations marking the anniversary of the Liberation of the South and National Reunification later this year.

In Phase 2 (2028–2030), FPT plans to expand the plant's total area to approximately 6,000 square meters, with 18 newly installed functional testing lines, 3 reliability and endurance testing zones, expanded both conventional packaging lines (QFN, QFP, DFN, etc.), additional CSP (Chip Scale Package), WLP (Wafer Level Package) lines, along with advanced IC packaging lines, collectively ramping the plant's total output to billions of units per year.

These investments are expected to raise the plant's capacity to billions of products annually. In parallel, FPT will strengthen its testing capabilities for high-end chips serving IoT, automotive applications, and AI-on-the-edge SoC (System-on-Chip) solutions, further completing the semiconductor value chain.

At the event, Mr. Bui Hoang Phuong, Deputy Minister of Science and Technology, affirmed: "Vietnam has advantages in human resources and has attracted numerous chip design companies to invest and employ Vietnamese engineers, laying the foundation for domestic chip design enterprises. In the global supply chain, Vietnam plays an increasingly important role in packaging and testing, although these stages are still largely dominated by foreign companies. FPT's investment in an advanced testing and packaging plant completes a critical missing link, helping to close Vietnam's semiconductor ecosystem. This concrete project demonstrates FPT's commitment to turning aspirations into action—bringing Vietnamese intelligence to the world and positioning Vietnam more clearly on the global semiconductor map."

Notably, FPT signed a series of cooperation agreements with leading semiconductor technology partners in Vietnam and internationally. Partnering with major domestic and global corporations represents a strategic approach for FPT to master semiconductor technologies in the long term.

Specifically, FPT and Viettel entered into a comprehensive partnership to build sovereign semiconductor capabilities through end-to-end value chain integration, covering training, design, fabrication, testing, packaging, and commercialization. The collaboration focuses on the joint development of AI-on-the-edge SoC chips on 28–32nm process nodes, serving ecosystems of cameras, drones, unmanned aerial vehicles (UAVs), and smart devices. This strategic alliance between two of Vietnam's leading technology groups aims to complete a closed-loop national semiconductor ecosystem. Together with Viettel's groundbreaking ceremony for Vietnam's first semiconductor fabrication plant, FPT's announcement of the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant represents a strong and concrete action, reaffirming Vietnam's determination to master key stages of the national semiconductor value chain.

In parallel, FPT also signed agreements with prominent international semiconductor partners, including Restar—to advance R&D in semiconductor testing and packaging technologies and to commercialize chips tested and packaged by FPT; Winpac—to promote semiconductor commercial cooperation and explore potential joint investment in FPT's testing and packaging facilities in Vietnam; and VSAP LAB—to pursue comprehensive cooperation from research to mass production, optimizing advanced packaging and testing capabilities while jointly developing highly specialized semiconductor talent.

At the event, FPT also announced plans to research and develop AI-on-the-edge System-on-Chip (SoC) solutions, aiming to fully master the smart device ecosystem encompassing cameras, drones, and unmanned aerial vehicles (UAVs).

FPT is a pioneering Vietnamese enterprise in the development of "Make in Vietnam" chips, with more than a decade of engagement in the semiconductor industry. To date, FPT has built a comprehensive semiconductor ecosystem spanning chip design, packaging, testing, and workforce development, with the ambition of positioning Vietnam as a key semiconductor hub in the region.

FPT focuses on the research and development of core chip product lines, including power ICs, power management ICs (PMICs), and AI-on-the-edge SoC chips. In parallel, FPT is accelerating high-quality workforce development, targeting the training of 10,000 semiconductor engineers by 2030 through a multi-tier education system and international collaboration. A flagship initiative is the "2+2" program, under which students study two years at FPT University, followed by two years of specialized training in Taiwan region or South Korea, and subsequently undertake internships at leading companies. In 2025, FPT inaugurated the High-Tech and Semiconductor Center in Da Nang and the Vietnam Semiconductor Incubation and Development Center (V.S.I.C) in Hanoi. Notably, in December 2025, FPT became the first Vietnamese enterprise to export commercial semiconductor chips to Japan, reaffirming its growing position in the global semiconductor value chain.

Capcon’s story is one of resilience, innovation, and determination. Co-founded by Mr Wang Honggang, who also serves as the company’s co-founder and CTO, Capcon was born out of a desire to continue innovating after a prior R&D centre in Singapore closed. Rather than let the curtain fall on a promising technology, the team decided to pursue a more ambitious path: to design and build differentiated bonding machines that would provide customers with faster, more accurate, and cost-effective solutions for advanced packaging needs.

This drive was fuelled by the rising global demand for advanced packaging tools capable of handling new materials and complex chip designs— especially in the context of AI, high-performance computing (HPC), and next- generation electronics.

Capcon specializes in designing and manufacturing high-speed, high- precision bonders—machines that lie at the heart of the semiconductor packaging process. These tools enable customers to achieve faster throughput, higher yields, and better cost-of-ownership compared to traditional options.

What sets Capcon apart is its holistic approach. Beyond providing hardware, the company also helps customers validate and scale processes through pilot/demo lines, enabling them to see real-world results before committing to full-scale deployment. This “proof-before-purchase” model has earned Capcon the trust of tier-1 global customers, even winning out against long- established competitors despite their aggressive pricing strategies.

Starting up in the semiconductor equipment space is no small feat. Capcon faced numerous challenges in its early years, from capital intensity to brand invisibility in a market dominated by 50–130-year-old incumbents. Yet, the company tackled these hurdles head-on. It secured angel funding, placed engineers onsite to ensure customer success, and transformed demo-line wins into 24/7 high-volume manufacturing (HVM) lines at key customer sites.

Capcon’s approach reflects its customer-first culture, marked by speed, precision, and a strong sense of ownership. Whether it’s a technical issue or a new integration challenge, the company’s teams are known for their fast response and ability to innovate under pressure.

With headquarters in Singapore and operational footprints in China, Taiwan, Southeast Asia, and North America, Capcon is already a global company. It leverages a network of regional agents, partners, and process-IP collaborators to reach customers worldwide. Though it doesn’t operate through formal franchises, its strategy of deep collaboration allows for flexibility, rapid customization, and seamless integration.

Looking ahead, Capcon is setting its sights on Europe, where conversations with potential partners are already underway. In the next year, the company plans to expand its demo-line capacity and key installations, while its five- year vision includes capturing a 15% global market share in wafer-level packaging, expanding its 2.5D/3D tool family, and deepening its presence in North America and Europe.

Capcon’s R&D roadmap is as ambitious as its business goals. Development plans include new face-up/face-down bonding variants, enhanced 2.5D/3D packaging capabilities, and significantly improved vision and automated optical inspection (AOI) systems. These innovations are designed to keep Capcon’s customers ahead in a world where product cycles are shrinking and performance demands are rising.

What further distinguishes Capcon is its tight control over operations. With system ownership in Singapore and manufacturing in China, the company ensures quality while maintaining cost competitiveness. Standardized platforms, clear service protocols, and detailed build playbooks all contribute to operational excellence.

Beyond its commercial goals, Capcon is committed to societal development. The company collaborates with universities and offers training via its demo lines, preparing the next generation of semiconductor engineers and operators. As it continues to scale, Capcon aims to launch more formal community programs, further embedding itself in the ecosystems it serves.

Employee performance is managed through structured KPIs, half-yearly reviews, and goal alignment with product roadmaps. The result is a builder- driven, innovation-focused culture where each team member is empowered to “own the outcome.”

Capcon’s rise in the semiconductor landscape is marked by notable achievements. Among the highlights are wins against entrenched incumbents, where Capcon not only matched but exceeded performance benchmarks—even after rival companies slashed prices. Perhaps most satisfying, however, are the moments when pilot demos at customer sites evolved into full-scale, 24/7 production operations—a testament to the trust and results Capcon delivers.

Its unique selling propositions include faster machines, precision engineering, strong application support, and rapid engineering turnaround. These factors have cemented Capcon’s position as a go-to partner in advanced packaging.

A comprehensive S.W.O.T. analysis highlights Capcon’s strengths in technology ownership, precision, and responsiveness. While brand maturity remains a challenge, the company is well-positioned to seize growth opportunities created by the AI/HPC boom, rising demand for chiplets and 2.5D/3D packaging, and geopolitical shifts encouraging tech onshoring in the U.S. and Europe.

By staying ahead of supply chain risks, technology shifts, and competitive pricing pressure, Capcon is charting a bold course for long-term success.

In just a few years, Capcon Limited has transformed from a daring idea into a serious contender in the global semiconductor equipment market. With its unwavering focus on technology, customer success, and innovation, Capcon is not just keeping pace with industry leaders—it is redefining what’s possible in advanced packaging. As the demand for smarter, faster, and more efficient chips continues to grow, Capcon is ready to meet the future by every breakout in high-accuracy bonding technology.

The 2026 International Integrated Circuit Innovation Expo (IICIE 2026) returns to the Shenzhen World Exhibition & Convention Center from 9–11 September 2026, under the theme "Cross-Sector Convergence, Full-Chain Collaboration: Building a Distinctive IC Ecosystem." As the premier event dedicated to the complete integrated circuit value chain, IICIE 2026 comprehensively showcases IC products and applications, wafer fabrication, packaging and testing, core equipment, key materials, and core components. It will gather over 1,100 leading semiconductor companies, spotlighting breakthrough technologies and innovations across all key segments. >>>Get your free pass now.

Ø  Leading Semiconductor Manufacturers Gather for One-Stop Access to Core Resources

In semiconductor manufacturing, IICIE 2026 has already brought together a distinguished lineup of enterprises covering wafer fabrication, packaging and testing, semiconductor equipment, advanced materials, as well as core components and intelligent manufacturing solutions for the semiconductor sector:

Wafer Fabrication and Packaging & Testing: Leading players including BYD Semiconductor, DJEL, HLMC, Nexchip, and other top-tier wafer manufacturing and packaging specialists will showcase their capabilities.

Semiconductor Equipment: Industry giants such as ACM Research, AMEC, Aspiring, Huayu Semiconductor, Hwatsing Technology, Piotech, Longyoude, NAURA, will demonstrate advanced technologies across critical processes including lithography, etching, deposition, and inspection.

Materials Innovation: KFMI, NSIG, Qingyi Photomask, and other material suppliers will highlight breakthroughs in domestic production of silicon wafers, sputtering targets, and other core materials.

Core Components & Intelligent Manufacturing: KYKY, RF-Cube, Vacree, and others will present semiconductor core components and intelligent manufacturing solutions.

Additionally, previous editions of the event have drawn the participation of numerous industry leaders, including Anji Microelectronics, Fortune Precision, HIWIN Technologies, Huahong Semiconductor, Jingyi Automation Equipment, Kingsemi, NAURA, Nata Opto-electronic, Peric Special Gases, SKY Technology, Shanghai Sinyang, Siasun Semiconductor, Skyverse, TZTEK, TankeBlue, Tongfu Microelectronics, and among over a thousand other prominent companies.

*Partial exhibitors listed in alphabetical order.

Ø  Chip Design Powerhouses Highlighted in Theme Pavilions

Empyrean Technology, Ingenic Semiconductor, Montage Technology, Sanechips Technology, Unisoc, and other chip design leaders will unveil high-performance computing, memory, communication, automotive-grade, and industrial control chip solutions, plus cutting-edge EDA tools. Past IICIE editions have also attracted industry leaders lincluding C*Core, Pango Microsystems, VeriSilicon, XMC, and Zhaoxin, creating a strong industrial cluster effect.

IICIE 2026 will feature dedicated “AI+ Application Pavilion” with three focused sectors: automotive electronics, high-performance computing, and smart wearables. It will bring together chip designers, solution providers, and terminal manufacturers to form a full-chain platform for technology display and business matching. Exhibitors will conduct live product teardowns focusing on core chips and components with real-time technical explanations, while immersive experience zones allow visitors to interact hands-on with cutting-edge products.

Ø  High-Precision Drive Solutions Power Intelligent Manufacturing Upgrades

Semiconductor processing is rapidly advancing into high-end equipment, precision manufacturing, and smart production lines. As automation evolves toward advanced semiconductor manufacturing, core components play an enabling role. IICIE 2026 provides one-stop access to servo motion control systems, industrial sensors, machine vision, and other key components, delivering the hardcore technologies that drive automation equipment evolution and help companies bridge the gap from general automation to advanced semiconductor manufacturing.

20+ High-Level Concurrent Forums Featuring Industry Thought Leaders

IICIE 2026 will bring together globally influential experts, scholars, and industry leaders to address critical fields including semiconductor manufacturing, equipment and materials, advanced packaging, CPO (Co-packaged Optics), compound semiconductors, machine vision, intelligent manufacturing, and green fab operations. By focusing on application scenarios such as AI chips, RISC‑V, smart vehicles, consumer electronics, security, and storage chips, IICIE 2026 will build an efficient bridge between chip technology and end-market demand, driving deep collaboration among industry, academia, research, and application sectors. IICIE 2026 key forums include:

l  IICIE 2026 Opening Ceremony & Integrated Circuit Innovation Forum centers on chip manufacturing, covering macro topics such as “AI Empowerment and Chip-Cloud Synergy” as well as advanced packaging, equipment, and materials, offering a comprehensive view of the latest advancements in chip manufacturing.

l  IWAPS International Workshop on Advanced Patterning Solutions, a world-class lithography event now in its 9th edition, will gather global giants and domestic leaders including Advanced Manufacturing DJEL, EDA, KLA, and ZEISS, serving as a vital link between China and the global lithography innovation ecosystem.  

l  The Global Semiconductor Analysts Conference will focus on “Navigating a New Semiconductor Era 2026–2030”, providing strategic insights for industry and investment communities.

l  The 1st Integrated Circuit Product and Application Collaborative Innovation Conference will create a high-level dialogue platform between chip design and end applications. Leading terminal companies including BYD, OPPO, and Xiaomi will join chip giants such as Unisoc and VeriSilicon to address technical challenges and commercialization in smart vehicles, embodied AI, and industrial manufacturing.

Ø  Three Co-located Expos, One Ecosystem: Optoelectronic Integration Breaking Down Industry Silos

IICIE 2026 co-locates with CIOE (China International Optoelectronic Exposition) and elexcon (Shenzhen International Electronics & Embedded Expo), creating an unprecedented industry convergence spanning integrated circuits + optoelectronics + electronics and embedded systems. This tri-expo synergy integrates comprehensive industry resources — one badge grants full access to all three exhibitions, enabling visitors to connect with premium suppliers, discover frontier technologies, expand high-level industry networks, and seize core opportunities across the semiconductor ecosystem. This is a must-attend platform for professionals in semiconductors and related fields.

Spanning 340,000 square meters, the three co-located events will host over 5,000 exhibitors, and are expected to attract more than 240,000 professional visitors from home and abroad, powerfully driving the deep integration of the integrated circuit, optoelectronics, and embedded electronics industries. In the span of a single exhibition, attendees can experience the complete industry chain from semiconductor manufacturing and chip design to optical chips, optical modules, sensors, embedded systems, and downstream applications spanning consumer electronics, smart vehicles, robotics, energy, displays, security, and beyond.

Registration for IICIE 2026 is now fully open. Complete your quick registration to secure your place at this premier semiconductor industry event and gain early access to global industry resources. Register by April 15 to receive the complete set of IICIE 2025 show catalogue! This is the ultimate destination for semiconductor professionals to find suppliers, explore cutting-edge technologies, expand industry networks, and seize market opportunities.

Meanwhile, IICIE 2026 booths are still in high demand. Leveraging its core strengths—a full-industry-chain showcase, concentration of leading companies, resource integration across three exhibitions, and high-level conferences—IICIE 2026 offers exhibitors a one-stop platform for brand promotion, technical exchange, client engagement, and market expansion. Quality players in the semiconductor industry are cordially invited to join. Book your booth now to tap into South China's vast application market and connect with global IC resources and premium buyers.