In all modern robotic platforms, vision is the foundation for perception, safety, and autonomy—but also one of the most challenging subsystems to integrate. GMSL2/3 cameras have become the industry standard for high‑bandwidth, low‑latency perception, yet the bring‑up process—especially with advanced SoCs—frequently requires weeks of kernel‑level optimization and vendor‑specific driver tuning.

Breaking the Bottleneck: Pre-Validated GMSL Cameras

Whether enabling SLAM navigation in AMRs, stereo depth perception for humanoid locomotion, or high‑speed industrial inspection for robotic arms, developers face the same barriers:

• Desired cameras are often not supported on the preferred edge computing platforms
• Reference designs published by CPU vendors are not applicable
• High cost of camera enablement
• Camera drivers are not upgraded with the latest edge computer BSP and OS

Advantech closes this gap through deep collaborations with NVIDIA, Qualcomm, Intel, and Rockchip. By mastering the driver and kernel requirements of each ecosystem, Advantech provides production‑ready, pre-validated GMSL drivers in association with top-notch camera vendors.

Expansive Camera Ecosystem and Joint Design-in Service

Advantech AFE/ASR series support a broad portfolio of validated GMSL2/3 cameras, covering the full breadth of perception needs across different robot types. Developers can choose from 2D, Stereo, and 3D cameras made by the following partners:

• APPRO
• Basler
• D3 Embedded
• e-con
• FRAMOS
• innodisk
• Leopard Imaging
• Orbbec
• oToBrite
• RealSense
• SENSING
• StereoLabs

Advantech and the camera partners jointly provide design-in service that accelerates robotics vision development by supporting new camera‑SoC enablement, optimal sensor selection, image quality tuning, and customized driver development. This collaboration streamlines integration, shortens development cycles while ensuring reliable and scalable deployment across diverse robotic platforms and applications.

One‑Click Installation and Long-Term BSP Support

At the center of Advantech's vision strategy is the One‑Click Installation Package, which transforms camera integration from a complex engineering task into a simple, streamlined experience.

GMSL camera drivers are included and maintained in the board support packages (BSPs) of Advantech's robotics controllers, particularly the AFE and ASR series. In addition, the drivers are provided as ROS Nodes within the Robotic Suite—a complementary software package consisting of open-source toolkits like ROS2 and Autoware, optimized AI inferencing SDKs, and sample codes for robotic applications.

Multi‑Architecture Robotics Controller Series

Designed for real‑time responsiveness and high‑performance edge AI processing, the AFE/ASR series deliver reliable perception, motion control, and multi‑sensor integration within a unified software environment. Turnkey GMSL enablement, continuous driver maintenance, and streamlined sensor integration significantly accelerate deployment across diverse robotic applications.

The AFE/ASR series are available as commercial off‑the‑shelf carrier boards and system‑level products built on leading processor platforms, including NVIDIA® Jetson™ Thor, Jetson AGX Orin™, Jetson Orin™ NX, Qualcomm® Robotics platforms such as the IQ9 series, Intel® Core™ Ultra processors, and Rockchip RK3588‑based solutions. This broad platform coverage enables design flexibility, modular scalability, and long‑lifecycle availability, providing robotics developers with a stable foundation for building next‑generation autonomous systems.

Learn more about Advantech's Robotics Solutions: here

About Advantech

Advantech is a global leader in IoT intelligent systems and embedded platforms, with the corporate vision of "Enabling an Intelligent Planet." To embrace the trends of edge computing and artificial intelligence, Advantech fully deploys its sector-driven strategy and focus on Edge Computing and Edge AI. In the meantime, Advantech is enhancing its global presence and core competitiveness by integrating its Edge Computing hardware platform, the WISE-IoT software platform, and sector-specific Edge AI solutions with domain expertise.

Contact
Cindy.liu@advantech.com.tw 

SHENZHEN, China, April 1, 2026 /PRNewswire/ -- On March 27, 2026, the MemoryS 2026 Summit concluded successfully in Shenzhen. Bringing together key players from the global memory storage industry chain, TWSC centered its exhibition on "Full-Stack AI+ Storage Solutions." Leveraging a foundational technology system optimized for AI workloads, the company presented comprehensive storage solutions spanning data centers and edge-side AI, highlighting its systematic capability upgrades and practical storage applications in the AI era.

Accelerated Upgrades in Full-Stack AI+ Storage Technology, Enabling Full-Link System Synergy.

As AI workloads demand higher concurrency, lower latency, and enhanced sustained write capabilities, differentiated requirements emerge across scenarios such as edge-side and data center applications. A single storage product can no longer support complex application needs; storage is evolving from single-point performance optimization toward comprehensive, system-level synergy. TWSC, through its full-chain technology system encompassing "self-developed controller + firmware algorithm + scenario adaptation," complemented by "in-house high-end manufacturing capabilities and supply chain assurance," deeply integrates storage into the foundational design of scenario-based applications. This achieves systematic synergy of "hardware-firmware-algorithm" with host systems and AI algorithms, facilitating large-scale deployment of solutions and becoming a critical enabler of scenario value.

Comprehensive AI Application Scenarios Across the Board, Driving Storage Solutions Toward a System-Level Value Transformation.

AI Data Centers: Supporting High Concurrency and Stable Operation with Enterprise-Grade Storage Solutions.

TWSC has built a full-stack capability system for AI data centers and intelligent computing scenarios, encompassing "controller chip + firmware algorithm + system-level integration." Its product portfolio covers PCIe/SATA enterprise SSDs and DDR5 RDIMM (5600MT/s, 6400MT/s), providing high-bandwidth, low-latency, and highly reliable storage support for AI training, inference, and massive data processing. With the breakthrough of its first self-developed enterprise SSD controller, TWSC continuously advances the synergistic optimization of self-developed controllers and firmware. Combined with its testing and validation systems and mass production capabilities, the company ensures stable and efficient data support for intelligent computing centers while guaranteeing reliable operation for large-scale data.

Edge AI: Adapting to Efficiency and Low Power Consumption with Embedded Storage.

Edge AI devices require not only efficient real-time data throughput capabilities but also careful consideration of power consumption and form factor. TWSC has established an embedded product system covering eMMC, UFS, and LPDDR series, offering flexible and adaptable storage solutions for different terminal types. Leveraging innovative use of QLC NAND flash and small-form-factor packaging technologies, the company provides high-capacity, highly integrated embedded storage solutions. Meanwhile, its LPDDR5/5X low-power memory solutions support data transfer rates of up to 8533Mbps and beyond, enhancing bandwidth while optimizing power efficiency, ensuring stable operation for edge AI in multitasking and real-time inference. These products have completed deep adaptation with domestic SoC platforms such as UNISOC and Rockchip, delivering reliable and stable storage capabilities for edge AI scenarios.

Diverse Scenarios: Expanding the Boundaries of Consumer and Industrial Applications.

TWSC continues to expand its diverse application scenarios, enhancing product adaptability across different environments. For AI PCs, high-performance computing, and content creation, TWSC is deploying PCIe 5.0 SSDs and DDR5 memory products, and has introduced DDR5 memory solutions based on Client Clock Driver (CKD) technology, operating at speeds up to 7200MT/s. The dual 32-bit independent channel design achieves 64-bit parallel bandwidth, effectively optimizing high-frequency signal integrity to meet high bandwidth and stability requirements. In the industrial sector, focusing on wide temperature range, long lifespan, and high reliability, TWSC provides storage solutions suitable for industrial control, cybersecurity, and other scenarios, ensuring stable operation in complex environments.

High-End Manufacturing and Testing: Building Multi-Dimensional Validation Capabilities to Ensure Large-Scale Delivery.

TWSC is continuously enhancing its high-end manufacturing and testing capabilities, actively advancing the construction of its Guangming Intelligent Manufacturing Base. The company has established intelligent production lines featuring "automated production + digitalized control," building multi-dimensional validation capabilities covering enterprise and embedded products. Addressing critical dimensions such as performance, reliability, and compatibility, TWSC is creating a high-end storage validation and manufacturing platform tailored for AI scenarios. Coupled with robust testing capabilities and laboratory support, the company rapidly responds to the high-quality, customized, and large-scale demands of AI storage delivery.

Moving forward, TWSC will continue to delve deeply into storage technology, unlocking scenario value through systematic synergy, and pioneering new frontiers in storage for the intelligent era.