【2026年4月16日，臺北訊】全球領先的AI與新創產業盛會——COMPUTEX 2026將於6月2日至5日在台北南港展覽館1、2館及世貿1館隆重登場。主辦單位外貿協會（TAITRA）今日宣布，備受全球期待的COMPUTEX Keynote（主題演講）報名系統即日起正式開放。

COMPUTEX 2026全球主題演講Keynote報名正式啟動！論壇史上最大規模一票到底　早鳥優惠最後倒數

今年Keynote陣容堪稱史上最豪華，匯聚高通（Qualcomm）、Marvell、Intel、聯發科技（MediaTek），NXP及思科Cisco等全球科技領袖，將在展前與展期間親自揭曉AI加速運算、邊緣運算及次世代行動平台的最新戰略。同時，今年規模創紀錄的COMPUTEX Forum全球科技論壇，早鳥優惠價NT$1,990即將於4月20日截止，籲請業界人士把握最後優惠購票機會。

COMPUTEX Forum論壇：史上最大規模，體驗一票到底的知識饗宴

今年的COMPUTEX Forum以「AI Together」為核心，不僅是歷年來規模最大的一次，更採「一票到底」，購票聽眾可在6月2日至4日期間，深度參與包含「機器人、自動化與實體AI」、「生成式AI應用」及「資料智能與安全」等六大核心主題論壇，與NVIDIA、Microsoft、Google DeepMind等30位全球頂尖專家面對面。

全球科技巨擘齊聚：Keynote演講場次資訊

Qualcomm（高通）總裁暨執行長Cristiano R. Amon—（全球記者會暨高通開幕主題演講）

時間：6月1日（一）下午2:00至3:15

地點：南港展覽館2館7樓701會議室

Cisco（思科）SVP, Cisco Compute Jeremy Foster

時間：6月1日（一）下午3:00至3:45

地點：南港展覽館2館7樓701會議室

Marvell主席暨執行長Matt Murphy

時間：6月2日（二）10:30至11:30

地點：南港展覽館2館7樓701會議室

Intel（英特爾）執行長Lip-Bu Tan

時間：6月2日（二）13:30至14:30

地點：南港展覽館2館7樓701會議室

NXP（恩智浦）總裁暨執行長Rafael Sotomayor

時間：6月2日（二）下午3:30至4:30

地點：世貿一館2樓345會議室

MediaTek（聯發科技）副董事長暨執行長 蔡力行博士

時間：6月3日（三）10:30至11:30

地點：南港展覽館2館7樓701會議室

【報名與活動資訊】

Ÿ   官方報名網址：events.computextaipei.com.tw/zh-tw/

Ÿ   展覽日期：2026年6月2日至6月5日

Ÿ   展覽場館：台北南港展覽館1館、2館；世貿1館。

更多相關展覽資訊請參考：

COMPUTEX官網：www.computextaipei.com.tw

InnoVEX官網：www.innovex.com.tw

關於COMPUTEX

COMPUTEX創辦於1981年，40年來一路與全球ICT產業一同成長、茁壯，見證產業發展與轉變的歷史性時刻，每年吸引超過4萬名的國際買主來臺參觀及採購，亦是國際指標廠商選擇公布劃時代產品的首選平台。 

臺灣具備完整全球資通訊產業鏈，立足臺灣的COMPUTEX，為中華民國對外貿易發展協會與台北市電腦商業同業公會共同主辦，COMPUTEX為全球指標AI和新創展覽，提供全球創業先鋒產業知識交流平臺，創造更多技術革新的火花。

關於外貿協會

中華民國對外貿易發展協會（簡稱外貿協會或貿協）為臺灣最重要的貿易推廣機構，係由經濟部結合民間工商團體成立之公益性財團法人，以協助業者拓展對外貿易為設立宗旨。目前，本會擁有1,300多位海內外專業經貿人員，除臺北總部外，設有桃園、新竹、臺中、臺南及高雄等5個國內辦事處、遍佈全球各地超過60個海外據點及超過300個簽有合作協議之國際貿易推廣姐妹機構，形成完整的貿易服務網，提供零時差、無國界的即時服務，持續與廠商共同追求台灣經濟的穩健發展，是業者拓展貿易的最佳夥伴。

為強化跨領域整合創新，本會定位為國際鏈結智慧整合中心（smart integrator），結合法人、大學、觀光、展會、城市、公協會、海外台商，為業者開發國際市場、進行國際合作、數位轉型、連接國際網絡，提供整合性、數位化服務，期許成為臺灣「數位經貿的領航者」及「創新模式的推動者」。

【2026年3月31日，臺北訊】COMPUTEX主辦單位外貿協會（TAITRA）宣布，NXP總裁暨執行長Rafael Sotomayor應邀發表COMPUTEX 2026主題演講。這場備受矚目的演講將於6月2日下午在台北世界貿易中心2樓盛大登場。

在智慧邊緣——數據與即時決策交會之處——NXP正引領邊緣（Edge AI）與實體人工智慧（Physical AI）的發展步伐。透過結合在安全、智慧邊緣運算上的領導地位，以及可擴展的人工智慧支援能力，NXP正協助客戶打造更聰明、更安全、更具自主性的實體世界系統。

Rafael Sotomayor的主題演講將深入探討「實體人工智慧」的核心論點——強調其變革性的潛力、實現過程中所需面對的挑戰與架構進展、定義其本質的安全與保障需求，以及NXP在推動人工智慧從數位領域成功落地至現實世界中所扮演的關鍵角色。

COMPUTEX Keynote報名預計於4月中旬開放，請鎖定官方網站獲取最新消息。

COMPUTEX 2026將於6月2日至6月5日登場，展出場域橫跨南港展覽館1、2館、世貿1館及台北國際會議中心，打造多場館科技展演版圖，同時展覽規模再創新高，共1,500家海內外企業使用達6,000個攤位，完整建構橫跨研發、製造到應用的「COMPUTEX科技生活圈」。

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更多相關展覽資訊請參考：

COMPUTEX官網：www.computextaipei.com.tw

InnoVEX官網：www.innovex.com.tw

關於COMPUTEX

COMPUTEX創辦於1981年，40年來一路與全球ICT產業一同成長、茁壯，見證產業發展與轉變的歷史性時刻，每年吸引超過4萬名的國際買主來臺參觀及採購，亦是國際指標廠商選擇公布劃時代產品的首選平台。 

臺灣具備完整全球資通訊產業鏈，立足臺灣的COMPUTEX，為中華民國對外貿易發展協會與台北市電腦商業同業公會共同主辦，COMPUTEX為全球指標AI和新創展覽，提供全球創業先鋒產業知識交流平臺，創造更多技術革新的火花。

關於外貿協會

中華民國對外貿易發展協會（簡稱外貿協會或貿協）為臺灣最重要的貿易推廣機構，係由經濟部結合民間工商團體成立之公益性財團法人，以協助業者拓展對外貿易為設立宗旨。目前，本會擁有1,300多位海內外專業經貿人員，除臺北總部外，設有桃園、新竹、臺中、臺南及高雄等5個國內辦事處、遍佈全球各地超過60個海外據點及超過300個簽有合作協議之國際貿易推廣姐妹機構，形成完整的貿易服務網，提供零時差、無國界的即時服務，持續與廠商共同追求台灣經濟的穩健發展，是業者拓展貿易的最佳夥伴。

為強化跨領域整合創新，本會定位為國際鏈結智慧整合中心（smart integrator），結合法人、大學、觀光、展會、城市、公協會、海外台商，為業者開發國際市場、進行國際合作、數位轉型、連接國際網絡，提供整合性、數位化服務，期許成為臺灣「數位經貿的領航者」及「創新模式的推動者」。

【2026年3月24日，臺北訊】COMPUTEX主辦單位外貿協會（TAITRA）今日宣布，英特爾執行長陳立武將於全球指標性科技展會COMPUTEX 2026發表主題演講。

陳立武的主題演講將於6月2日在台北南港展覽館二館7樓舉行，分享在AI時代下，英特爾對新世代運算的發展願景。

隨著AI正在重塑各行各業，陳立武將說明矽晶、系統與軟體領域的關鍵突破，以及透過與生態系的深度合作，共同推動效能、能源效率與規模化發展邁向更高層次。他也將分享英特爾如何與客戶及合作夥伴攜手合作，共同定義異質運算的未來，並建構支撐AI時代發展所需的基礎設施。

COMPUTEX匯聚全球科技領袖、創新者與產業夥伴，共同展示引領未來運算發展的突破性技術。陳立武的主題演講將為與會者帶來產業洞察，分享科技生態系的跨界合作如何加速創新，並為全球企業與開發者開創全新機會。

COMPUTEX Keynote報名預計於4月中旬開放，請鎖定官方網站以取得最新資訊。

COMPUTEX 2026將於6月2日至6月5日登場，展出場域橫跨南港展覽館1、2館、世貿1館及台北國際會議中心，打造多場館科技展演版圖，同時展覽規模再創新高，共1,500家海內外企業使用達6,000個攤位，完整建構橫跨研發、製造到應用的「COMPUTEX科技生活圈」。

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更多相關展覽資訊請參考：

COMPUTEX官網：www.computextaipei.com.tw

InnoVEX官網：www.innovex.com.tw

關於COMPUTEX

COMPUTEX創辦於1981年，40年來一路與全球ICT產業一同成長、茁壯，見證產業發展與轉變的歷史性時刻，每年吸引超過4萬名的國際買主來臺參觀及採購，亦是國際指標廠商選擇公布劃時代產品的首選平台。 

臺灣具備完整全球資通訊產業鏈，立足臺灣的COMPUTEX，為中華民國對外貿易發展協會與台北市電腦商業同業公會共同主辦，COMPUTEX為全球指標AI和新創展覽，提供全球創業先鋒產業知識交流平臺，創造更多技術革新的火花。

關於外貿協會

中華民國對外貿易發展協會（簡稱外貿協會或貿協）為臺灣最重要的貿易推廣機構，係由經濟部結合民間工商團體成立之公益性財團法人，以協助業者拓展對外貿易為設立宗旨。目前，本會擁有1,300多位海內外專業經貿人員，除臺北總部外，設有桃園、新竹、臺中、臺南及高雄等5個國內辦事處、遍佈全球各地超過60個海外據點及超過300個簽有合作協議之國際貿易推廣姐妹機構，形成完整的貿易服務網，提供零時差、無國界的即時服務，持續與廠商共同追求台灣經濟的穩健發展，是業者拓展貿易的最佳夥伴。

為強化跨領域整合創新，本會重新定位為國際鏈結智慧整合中心（smart integrator），結合法人、大學、觀光、展會、城市、公協會、海外台商，為業者開發國際市場、進行國際合作、數位轉型、連接國際網絡，提供整合性、數位化服務，期許成為臺灣「數位經貿的領航者」及「創新模式的推動者」。

【2026年3月17日，台北訊】COMPUTEX主辦單位之一外貿協會（TAITRA）宣布，高通（Qualcomm）總裁暨執行長Cristiano R. Amon應邀發表COMPUTEX 2026開幕主題演講。這場備受矚目的主題演講將於6月1日下午在南港展覽館2館7樓盛大登場。

高通技術公司正在定義運算的新時代，讓智慧運算無所不在––––從各類裝置、邊緣系統到資料中心皆能運行。在Cristiano Amon的領導下，高通技術公司整合裝置端智慧、邊緣至雲端的運算效能，以及新一代連接能力，特別在代理式（agentic）AI工作負載持續擴展之際，進一步加速AI全面普及。 

Snapdragon^®與Qualcomm Dragonwing™平台，代表了AI PC、個人AI裝置、智慧型手機、工業AI、機器人與資料中心等領域的運算與智慧突破，並在大規模部署下，於消費性與企業環境中實現即時決策、自主運作與情境感知能力。

COMPUTEX Keynote報名預計於4月中旬開放，COMPUTEX Forum現正開放早鳥報名，3月20日前至官網論壇完成報名者，不但可享有超優惠折扣，還可參加AI筆電抽獎。 

COMPUTEX 2026將於6月2日至6月5日登場，展出場域橫跨南港展覽館1、2館、世貿1館及台北國際會議中心，打造多場館科技展演版圖，同時展覽規模再創新高，共1,500家海內外企業使用達6,000個攤位，完整建構橫跨研發、製造到應用的「COMPUTEX科技生活圈」。

※Snapdragon和Qualcomm是高通技術公司和/或其子公司的產品。Qualcomm、Snapdragon和Qualcomm Dragonwing是高通公司的企業標章或註冊商標。

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更多展覽相關訊息，請自官網查詢：

COMPUTEX官網：https://www.computextaipei.com.tw/

InnoVEX官網：https://www.innovex.com.tw/

關於COMPUTEX

COMPUTEX創辦於1981年，40年來一路與全球ICT產業一同成長、茁壯，見證產業發展與轉變的歷史性時刻，每年吸引超過4萬名的國際買主來台參觀及採購，亦是國際指標廠商選擇公布劃時代產品的首選平台。 

台灣具備完整全球資通訊產業鏈，立足台灣的COMPUTEX，為中華民國對外貿易發展協會與台北市電腦商業同業公會共同主辦，COMPUTEX為全球指標AI和新創展覽，提供全球創業先鋒產業知識交流平臺，創造更多技術革新的火花。

關於外貿協會

中華民國對外貿易發展協會（簡稱外貿協會或貿協）為臺灣最重要的貿易推廣機構，係由經濟部結合民間工商團體成立之公益性財團法人，以協助業者拓展對外貿易為設立宗旨。目前，本會擁有1,300多位海內外專業經貿人員，除臺北總部外，設有桃園、新竹、臺中、臺南及高雄等5個國內辦事處、遍佈全球各地超過60個海外據點及超過300個簽有合作協議之國際貿易推廣姐妹機構，形成完整的貿易服務網，提供零時差、無國界的即時服務，持續與廠商共同追求台灣經濟的穩健發展，是業者拓展貿易的最佳夥伴。

2020年，甫迎50週年的外貿協會，為強化跨領域整合創新，本會重新定位為國際鏈結智慧整合中心（smart integrator），結合法人、大學、觀光、展會、城市、公協會、海外台商，為業者開發國際市場、進行國際合作、數位轉型、連接國際網絡，提供整合性、數位化服務，期許成為臺灣「數位經貿的領航者」及「創新模式的推動者」。

此次泰國館將以創新連結全求為主題。(泰國商務處提供)

【記者林子霞台北報導】泰國館為打造台泰創新交流平台，於6月2日至5日將參與亞洲指標新創科技展InnoVEX 2026，在台北南港展覽館二館4樓S1004盛大展出，集結多家泰國創新企業，展現泰國於新創科技、數位轉型及智慧應用等領域的發展成果，並進一步深化台泰科技產業交流合作。

InnoVEX為COMPUTEX旗下國際新創展會平台，長期匯聚全球創新團隊、加速器、投資人與科技產業代表，是亞洲重要的新創與科技媒合平台之一。今年展會聚焦 AI、未來科技與智慧應用發展，吸引全球創新能量齊聚台北。

此次泰國館由泰國商務處（Thai Trade Office, Taipei）主辦，共邀集7家泰國創新企業來台參展，包括BEDERLY CO., LTD.、CONNECTX CO., LTD.、DEEMMI PET CO., LTD.、HIP GLOBAL CO., LTD.、K.G. & PATRICK CO., LTD.、SDCX Co., Ltd.以及 TECH-X SERVICE CO., LTD.等，展出內容涵蓋智慧健康、數位服務、智慧寵物科技及創新解決方案等多元領域，展現泰國新創產業的技術能量與市場潛力。

除展覽展示外，泰國館亦將於展期間舉辦2場交流活動，邀請產業代表及新創團隊共同參與，促進跨國合作交流與商機媒合。「交流活動1｜Happy Hour」於6月4日15:00－17:00，地點在南港展覽館二館4F泰國館（攤位編號S1004）；「交流活動2｜Networking Dinner」於6月5日18:30，地點在NARA Thai Cuisine（南港 CITYLINK店）。預約登記交流活動：https://forms.gle/JMarDp7GmhQsdniu6，期望透過參與國際平台，進一步提升泰國品牌的能見度，並深化與台灣及全球科技生態圈之鏈結，推動更多跨域合作與創新發展機會。

COMPUTEX 2026吸引全球科技產業人士熱烈參與，展期間串聯國際創新能量與商機交流，展現台灣在全球AI產業鏈的重要地位。

【2026年6月5日，台北訊】全球指標性AIoT和新創產業展覽COMPUTEX 2026於今（5）日圓滿落幕，今年以「AI Together」為題，聚焦「AI運算」、「機器人&智慧移動」及「次世代科技」，匯集全球科技領導品牌、新創團隊及產業專家，共同展現AI驅動下的創新成果與未來趨勢。展期間吸引來自全球152個國家/地區共計111,312位國內外買主來台交流，主要包括日本、美國、韓國、中國、香港、新加坡、越南、印度、泰國及馬來西亞等國家，展現COMPUTEX作為全球AI產業合作、技術展示與商機媒合的重要平台地位。

實體AI成焦點 COMPUTEX展現產業落地新趨勢

AI技術持續快速演進，並加速從虛擬世界走向實體應用。根據PwC旗下Strategy&研究[1]指出，實體AI至2030年有望創造約4,300億歐元市場規模，未來3至5年將逐步進入大規模商業部署階段，應用範圍涵蓋製造、物流、醫療、航太等多元產業。因應此趨勢，COMPUTEX 2026重返世貿一館，首度設立「AI機器人區」，串聯供應鏈共同展示AI機器人和機器人具身智慧（Embodied AI）相關技術與解決方案，呈現從研發到落地的關鍵技術與完整生態系。同時新增「電子紙產業專區」與「科技應用暨體驗館」，共集結超過180家參展商，為COMPUTEX注入全新亮點。

全球科技領袖齊聚 勾勒AI產業發展藍圖

COMPUTEX 2026主題演講再度匯集全球科技巨擘，聚焦AI運算、邊緣運算、次世代行動平台及智慧移動等關鍵議題，由高通（Qualcomm）總裁暨執行長Cristiano R. Amon揭開序幕，接續由邁威爾科技（Marvell）董事長暨執行長Matt Murphy、英特爾（Intel）執行長陳立武，以及NXP總裁暨執行長Rafael Sotomayor分享產業觀察與技術發展方向。四場主題演講共吸引6000位觀眾參與，展現全球產業對AI未來發展的高度關注。

COMPUTEX Forum則匯聚來自全球指標企業的28位產業領袖與技術專家，深入探討AI運算、機器人、資料治理等六大核心議題。論壇報名人數較往年成長三倍，充分反映AI議題的高度熱度。論壇內容橫跨基礎架構、運算平台到產業應用與治理策略，協助企業掌握AI規模化部署與商業落地的重要契機。

InnoVEX規模創新高 全球新創能量齊聚台灣

作為亞洲重要的新創平台，InnoVEX 2026規模再創新高，參展新創團隊突破500家，較去年成長超過11%，以台灣、日本與韓國為前三大參展國家／地區，共吸引來自23國的新創企業參與。今年首度迎來全球最大開放式創新平台暨加速器之一的Plug and Play Taiwan，以及日本新創展覽機構Everidge進駐合作，進一步強化國際創新鏈結與市場拓展機會。

此外，法國、日本、韓國、泰國、澳洲、以色列、加拿大、義大利及捷克等9大國家館，同步展出AI、機器人、智慧移動等前瞻技術，打造具國際視野的創新交流平台。論壇則邀集來自法國、日本及美國等，以「AI實業落地」為主軸，探討涵蓋AI基礎設施藍圖、產業導入實務、開源商業模式，以及AI驅動的工作流程與數據策略轉型。

InnoVEX Pitch Contest持續整合「資金」、「算力」與「產業認證」三大關鍵資源，打造「全鏈結資源平台」助力對接參賽團隊與國際創投融資者，加速技術商業化與全球市場布局，最終由RLWRLD獲得本屆大獎。

永續與生活體驗並進 打造未來科技生活圈

COMPUTEX 2026持續深化永續展會理念，落實Reduce、Reuse、Recycle（3R）精神，攜手參展企業共同打造低碳、低汙染、低耗能的永續展會環境。今年永續設計獎首度依展位規模區分為「旗艦規模組」及「潛力新銳組」，鼓勵參展商持續投入永續創新與綠色實踐，最終分別由華碩聯合科技與創見資訊獲得金獎。

展會亦持續拓展科技與生活的跨界連結。COMPUTEX 2026攜手中華航空與GQ打造COMPUTEX Service Lounge，融合商務接待、生活風格與台灣特色體驗；紅牛、眠豆腐設互動休憩空間，提升觀展體驗。主辦單位亦與知名生成式藝術創作者阿亂合作，於南港展覽館一館入口打造大型互動科技藝術裝置，觀展者可在六米高的LED柱體上創作獨一無二的「植徑集」圖樣，為展會增添科技與創意交融的獨特氛圍。

COMPUTEX 2027將6月1日至4日於南港展覽館一、二館與世貿一館盛大辦理，持續實踐AI Together理念，攜手全球夥伴推動AI創新與產業發展，共創智慧未來。更多展覽資訊請參閱官網：http://www.computextaipei.com.tw

更多相關展覽資訊請參考：

COMPUTEX官網：www.computextaipei.com.tw

InnoVEX官網：www.innovex.com.tw

關於COMPUTEX

COMPUTEX創辦於1981年，45年來一路與全球ICT產業一同成長、茁壯，見證產業發展與轉變的歷史性時刻，每年吸引超過4萬名的國際買主來臺參觀及採購，亦是國際指標廠商選擇公布劃時代產品的首選平台。 

臺灣具備完整全球資通訊產業鏈，立足臺灣的COMPUTEX，為中華民國對外貿易發展協會與台北市電腦商業同業公會共同主辦，COMPUTEX為全球指標AI和新創展覽，提供全球創業先鋒產業知識交流平臺，創造更多技術革新的火花。

關於外貿協會

中華民國對外貿易發展協會（簡稱外貿協會或貿協）為臺灣最重要的貿易推廣機構，係由經濟部結合民間工商團體成立之公益性財團法人，以協助業者拓展對外貿易為設立宗旨。目前，本會擁有1,300多位海內外專業經貿人員，除臺北總部外，設有桃園、新竹、臺中、臺南及高雄等5個國內辦事處、遍佈全球各地超過60個海外據點及超過300個簽有合作協議之國際貿易推廣姐妹機構，形成完整的貿易服務網，提供零時差、無國界的即時服務，持續與廠商共同追求台灣經濟的穩健發展，是業者拓展貿易的最佳夥伴。

為強化跨領域整合創新，本會定位為國際鏈結智慧整合中心（smart integrator），結合法人、大學、觀光、展會、城市、公協會、海外台商，為業者開發國際市場、進行國際合作、數位轉型、連接國際網絡，提供整合性、數位化服務，期許成為臺灣「數位經貿的領航者」及「創新模式的推動者」。

[1] 報告來源：Strategy& “Physical AI: Intelligence in motion”

【2026年5月14日，台北訊】全球年度科技盛會COMPUTEX 2026將於6月2日至5日在臺北盛大登場。作為展會最受矚目的重點活動之一，COMPUTEX Forum目前報名已進入最後倒數階段。主辦單位表示，論壇持續開放報名中，優惠票價於5月20日截止，之後將恢復原價，邀請全球科技產業人士把握最後報名與優惠時機。

全球科技領袖齊聚 掌握AI轉型趨勢與未來布局

本屆論壇以「AI Together」為主軸，匯聚來自全球頂尖科技企業的30位高階主管與技術領袖，共同探討AI如何重塑產業樣貌、驅動企業轉型，論壇規模與議題完整度皆為歷年之最。

論壇內容聚焦AI技術從基礎架構到產業應用的完整生態系，涵蓋六大核心主題，包括「機器人、自動化與實體AI」、「AI運算、基礎架構與開發」、「生成式AI與智慧內容應用」、「AI裝置、物聯網與邊緣運算」、「產業落地AI應用」，以及「資料智能、治理與安全」。透過國際講者觀點與實務案例分享，深入剖析AI技術如何從研發創新快速邁向規模化應用，並加速製造、醫療、內容創作、智慧城市與企業服務等產業的新一波升級與轉型。

報名持續開放 5/20前享最後優惠

COMPUTEX Forum 2026目前報名持續開放報名中，5月20日前購票可享優惠票價新臺幣2,990元；5月21日起票價將恢復為新臺幣3,990元。隨著全球AI產業熱度持續升溫，論壇席次亦進入最後倒數階段，主辦單位呼籲有意參與者及早完成報名，把握與全球科技領袖交流的重要機會。

【購票資訊】

• 購票網站：COMPUTEX官方網站論壇報名頁面
• 論壇日期：2026年6月2日至6月4日
• 論壇地點：世貿1館2樓，南港展覽2館7樓

※ 注意事項：活動內容規劃以主辦單位最終公告為主，主辦單位外貿協會保有修改、變更或暫停本活動之權利。

更多相關展覽資訊請參考：

COMPUTEX官網：www.computextaipei.com.tw

InnoVEX官網：www.innovex.com.tw

關於COMPUTEX

COMPUTEX創辦於1981年，40年來一路與全球ICT產業一同成長、茁壯，見證產業發展與轉變的歷史性時刻，每年吸引超過4萬名的國際買主來臺參觀及採購，亦是國際指標廠商選擇公布劃時代產品的首選平台。 

臺灣具備完整全球資通訊產業鏈，立足臺灣的COMPUTEX，為中華民國對外貿易發展協會與台北市電腦商業同業公會共同主辦，COMPUTEX為全球指標AI和新創展覽，提供全球創業先鋒產業知識交流平臺，創造更多技術革新的火花。

關於外貿協會

中華民國對外貿易發展協會（簡稱外貿協會或貿協）為臺灣最重要的貿易推廣機構，係由經濟部結合民間工商團體成立之公益性財團法人，以協助業者拓展對外貿易為設立宗旨。目前，本會擁有1,300多位海內外專業經貿人員，除臺北總部外，設有桃園、新竹、臺中、臺南及高雄等5個國內辦事處、遍佈全球各地超過60個海外據點及超過300個簽有合作協議之國際貿易推廣姐妹機構，形成完整的貿易服務網，提供零時差、無國界的即時服務，持續與廠商共同追求台灣經濟的穩健發展，是業者拓展貿易的最佳夥伴。

為強化跨領域整合創新，本會定位為國際鏈結智慧整合中心（smart integrator），結合法人、大學、觀光、展會、城市、公協會、海外台商，為業者開發國際市場、進行國際合作、數位轉型、連接國際網絡，提供整合性、數位化服務，期許成為臺灣「數位經貿的領航者」及「創新模式的推動者」。

Originating from Project STEALTH, first introduced in 2022, the STEALTH concept pioneered the industry's reverse-connector motherboard design for more streamlined PC assembly and personalized decoration with more front-side space. At COMPUTEX 2026, GIGABYTE demonstrates the latest evolution of STEALTH builds with its reverse-connector B850M AORUS STEALTH ICE motherboard and AORUS GeForce RTX™ 5090 STEALTH ICE graphics card for minimalist layouts. In addition to supporting its own chassis lineup, GIGABYTE also expands the STEALTH ecosystem with more than 10 renowned chassis manufacturers, including Corsair, LIAN LI, InWin, Montech, Thermaltake, Cooler Master, HYTE, and more. The partnership makes the Project STEALTH the most compatible and flexible solution for cableless PC builds across the market.

Alongside the sleek STEALTH builds, GIGABYTE also introduces the elegant WOOD series lineup, blending Zen-inspired aesthetics with natural materials to bring warmth and organic beauty into a modern PC setup. The wood texture transforms cold hardware into elegant lifestyle creations, creating a harmonious combination of natural textures and high-performance computing. To further elevate the wooden aesthetic concept, GIGABYTE collaborates with Noctua and TRYX during COMPUTEX 2026, presenting wood-themed PC builds with refined craftsmanship and uncompromising performance of the X870E AERO X3D WOOD series motherboard.

To experience the sleek STEALTH and elegant WOOD PC builds, please visit GIGABYTE Consumer Booth #M0520 at Nangang Exhibition Hall 1, 4F during COMPUTEX 2026, or explore more product information on the official website.

As AI workloads continue to scale, storage is no longer just a back-end infrastructure component. It has become a critical factor that directly impacts AI inference efficiency, GPU utilization, and overall system performance. This year, Graid Technology will place KV Cache Offloading at the center of its COMPUTEX showcase, addressing the growing demand for high-speed data access and efficient memory management in large language model workloads, including long-context inference, multi-turn conversations, and multi-user AI applications.

To address different AI deployment scenarios, Graid Technology will showcase two core solutions: SupremeRAID™ AE and SupremeRAID™ HE. SupremeRAID™ AE is designed for enterprise AI and GPU servers, leveraging existing GPU resources to accelerate NVMe RAID, improve AI inference and KV Cache access performance, and deliver up to a 4x improvement in TTFT, enabling AI applications to respond with lower latency and greater efficiency. SupremeRAID™ HE is designed for AI data centers and HPC environments, providing a high-performance, scalable, and highly available AI storage architecture that helps achieve approximately a 2x improvement in TTFT, accelerating large-scale inference and KV Cache Offloading workflows.

Another major highlight at COMPUTEX 2026 is the introduction of VROC™ by Graid Technology Inc. Purpose-built for Intel® Xeon® platforms, VROC™ by Graid is a CPU-native NVMe RAID solution that further expands Graid Technology's RAID storage portfolio. By extending its product lineup into CPU-native RAID architecture, VROC™ by Graid complements Graid Technology's existing SupremeRAID™ GPU RAID solutions and provides enterprises with a complete RAID storage spectrum across CPU and GPU architectures, from desktop workstations to enterprise data centers.

Through its SupremeRAID™ product family and the newly introduced VROC™ by Graid Technology Inc., Graid Technology continues to drive RAID storage innovation and build the next-generation storage backbone for AI, enterprise, and high-performance computing markets.

Event Information
Event: COMPUTEX 2026
Date: June 2–5, 2026
Location: TaiNEX 2, Taipei
Booth: R0502

In collaboration with AAEON, Altob, DEEPX, and Posiflex, Apacer is demonstrating practical Edge AI deployments across smart factory, smart retail, and smart transportation applications. One of the key highlights is the jointly developed "ViClaw Edge AI + Storage System" with DEEPX, integrating SSD architecture with NPU acceleration to deliver up to 50 TOPS of AI computing performance for edge servers and AI devices, significantly strengthening local Edge AI inference capabilities.

To address thermal challenges in high-density Edge AI environments, Apacer is introducing several advanced cooling technologies, including the GraTherX thermal solution for fanless devices, the CoreGlacier 2 cooling technology featuring a dual-fin architecture, and the Thermal-Ink printed cooling solution optimized for ultra-thin systems. GraTherX can reduce DDR5 module temperatures to 20°C while improving MTBF by approximately 2.7 times, helping enhance long-term operational stability for Edge AI systems.

Apacer is also unveiling its latest BiCS8 PCIe Gen5 SSD series with capacities up to 32TB and sequential read/write speeds reaching 14,000 / 8,500 MB/s, targeting AI computing, data center, and edge server applications. In addition, the company is showcasing high-bandwidth CAMM2 memory solutions designed to support next-generation Edge AI workloads.

For gaming applications, Apacer is debuting the ZADAK PRO ROG CERTIFIED RGB DDR5 memory co-developed with ASUS Republic of Gamers. Designed for AMD platforms, the memory features DDR5-6000 CL28 low-latency specifications to deliver enhanced gaming stability and immersive performance.

Apacer will exhibit at Booth I0108, 1F, Taipei Nangang Exhibition Center Hall 1 during COMPUTEX 2026. Learn more: https://reurl.cc/ppbj0x

About COMPUTEX 2026
COMPUTEX 2026 will take place from June 2 to June 5, 2026, at Taipei Nangang Exhibition Center Hall 1. Apacer will exhibit at Booth I0108 on the 1st floor.

Taking place June 2–5 at the Taipei Nangang Exhibition Center, COMPUTEX 2026 is one of the world's premier technology exhibitions. PROMISE will host live demonstrations at Booth R0708 in Hall 2 (TaiNEX 2).

PROMISE's latest solutions are engineered for enterprise, AI datacenters, surveillance, and media & entertainment environments. The company will demonstrate how intelligent storage architectures can address key AI infrastructure challenges—particularly power constraints and capacity expansion—while sustaining the high performance required for next-generation workloads.

Featured Products at COMPUTEX 2026

BoosTrak Series
A purpose-built dual-node (Compute & Storage nodes), all-NVMe storage platform with RDMA/RoCE and 100/200/400GbE connectivity. Designed for ultra-low latency and high-throughput AI and datacenter workloads, it debuts the latest evolution of NVMeBoost^™.

VTrak 8206 NVMe All-Flash
Built on PCIe Gen5 with NVMe-oF support, this enterprise platform is optimized for AI-driven applications and real-time analytics.

Vess A8340
A fully integrated AI and intelligent surveillance platform powered by multi-GPU architecture and Intel^® Xeon^® 6 processors. With six PCIe Gen5 x16 slots, it combines storage, compute, and video analytics in a single scalable system.

Pegasus5 R12 Pro
A hybrid Thunderbolt^™ 5 storage solution with 12 HDD bays and 2 NVMe SSD bays, delivering up to 6,000 MB/s for demanding 4K/8K production workflows.

Pegasus5 N4
A portable Thunderbolt^™ 5 NVMe device offering up to 80Gbps bandwidth and 6,000 MB/s speeds, ideal for mobile and on-location creative work.

GreenBoost™ 2.0: Keep GPUs Busy. Not Power-Hungry

By reducing storage power consumption, GreenBoost 2.0 enables higher GPU utilization and supports larger-scale AI deployments within existing power and cooling limits.

Developed in collaboration with Toshiba, GreenBoost 2.0 integrates high-density JBOD architectures with energy-efficient, high-capacity HDDs to deliver a balanced approach to performance and sustainability.

James Lee, CEO of PROMISE Technology, commented:
"We are happy to continue working with Toshiba, beginning with GreenBoost 1.0 onward to GreenBoost 2.0, advancing AI-driven storage and sustainable infrastructure at COMPUTEX. As enterprises scale AI, power and cooling have become defining constraints. Through deep hardware and software integration, we are enabling customers to achieve both performance and energy efficiency at scale."

Noriaki Katakura, Division President, Storage Products Division, Toshiba Electronics Components Taiwan Corporation added: "As AI drives rapid data growth, enterprises need higher density with lower energy consumption. Through our collaboration with PROMISE Technology, combining high-density JBOD architecture and GreenBoost 2.0 with Toshiba's high capacity NL HDDs, we deliver an efficient, scalable foundation for modern data centers. We look forward to advancing ecosystem collaboration to support AI workloads while meeting sustainability goals."

NVMeBoost™

PROMISE proprietary feature NVMeBoost creates an optimized data pipeline—accelerating storage-to-GPU transfers while improving inter-GPU communication.

NVMeBoost represents a major step forward in making GPU-accelerated storage and high-speed networking accessible to mainstream enterprises. Organizations can achieve breakthrough performance for AI and data-intensive workloads while leveraging existing infrastructure.

For more information or to schedule a meeting at COMPUTEX 2026, visit www.promise.com
Booth: R0708

About PROMISE Technology

PROMISE Technology is a leading provider of high-performance storage solutions for enterprise, AI, surveillance, media & entertainment, and creative professionals. With a focus on innovation, reliability, and sustainability, PROMISE delivers intelligent storage architectures for the world's most demanding data environments.

As AI rapidly evolves from cloud computing into real-world deployment, COMPUTEX 2026 highlights key applications spanning AI servers, edge computing, robotics, automation, smart mobility, next-generation communications, and immersive technologies. The exhibition fully integrates the global AI supply chain while reinforcing Taiwan's strategic role as a global hub for technological innovation and advanced manufacturing.

James C.F. Huang, Chairman of TAITRA, stated: "COMPUTEX 2026, themed 'AI Together,' marks a pivotal turning point as the AI industry moves beyond the race for computing power and into real-world deployment — from manufacturing automation and elderly care to workforce transformation. Taiwan's resilient and comprehensive ICT supply chain, combined with its ability to rapidly integrate global technologies and innovative applications, positions COMPUTEX not only as a technology showcase, but also as a key platform for global AI collaboration and future applications."

Jason Chen, Chairman of the Taipei Computer Association, stated that COMPUTEX 2026, under the theme "AI Together," reflects a major shift as AI moves from isolated technological breakthroughs toward system integration and ecosystem-wide collaboration. He emphasized that AI competition is no longer defined solely by models or computing power, but increasingly by complete system capabilities spanning computing, connectivity, storage, energy efficiency, and applications. From chips and systems to real-world deployment, Taiwan will continue to play a pivotal role in global AI development.

COMPUTEX 2026 Focuses on AI Deployment and New Technology Ecosystems

Driven by the rapid growth of Edge AI and cross-domain integration, COMPUTEX 2026 centers on three major themes — "AI Computing," "Robotics & Smart Mobility," and "Next-Generation Tech." From chips and computing platforms to end-user applications, the exhibition demonstrates how AI is accelerating industrial transformation and reshaping everyday life, building a comprehensive "COMPUTEX Technology Ecosystem."

According to TrendForce, the global market for large language models (LLMs) in robotics is projected to exceed USD 100 billion by 2028, with a compound annual growth rate (CAGR) of 48.2%. In response to the rapid rise of Physical AI and intelligent robotics, COMPUTEX 2026 introduces the brand-new "AI Robotics Zone" at TWTC Hall 1, showcasing AI robotics, smart services, autonomous mobility, and human-machine collaboration applications while connecting the global robotics supply chain.

In addition, the newly launched "Tech Application & Experience Zone" and "E-Paper Industry Zone" focus on smart applications, sustainability, and immersive experiences, demonstrating how AI technologies are reshaping smart living, retail, healthcare, education, and sustainable environments.

Global Tech Leaders Gather to Define the Future of AI

This year's COMPUTEX Keynotes feature an impressive lineup of global technology leaders, including Cristiano R. Amon, President and CEO of Qualcomm; Matt Murphy, Chairman and CEO of Marvell; Lip-Bu Tan, CEO of Intel; and Rafael Sotomayor, President and CEO of NXP Semiconductors. Their presentations will explore AI accelerated computing, edge AI, intelligent automotive platforms, and next-generation semiconductor technologies, offering insights into the future direction of the AI industry.

Meanwhile, the COMPUTEX Forum reaches a record-breaking scale this year with 28 sessions over three days. The forum gathers 29 world-renowned experts from companies including NVIDIA, Microsoft, Google DeepMind, Qualcomm, Arm, and Cisco. Discussions will center on six major themes: "Robotics, Automation & Physical AI," "AI Computing, Infrastructure & Development," "Generative AI & Intelligent Content Applications," "AI Devices, IoT & Edge Computing," "Industrial AI Applications," and "Data Intelligence, Governance & Security." These sessions will highlight the latest technological advancements and practical applications spanning cloud-to-edge infrastructure and real-world AI deployment.

InnoVEX Brings Together Global Startup Innovation

The highly anticipated InnoVEX startup exhibition gathers nearly 500 startups from 23 countries this year, including nine national pavilions from France, Japan, South Korea, Thailand, Australia, Israel, Canada, Italy, and the Czech Republic, further demonstrating COMPUTEX's global influence as Asia's leading startup platform.

Focusing on AI, smart mobility, green technology, next-generation communications, and innovative applications, InnoVEX connects startups with global investors, accelerators, and technology companies, fostering cross-border collaboration and future business opportunities while embodying its core spirit of "Igniting Innovation and Connecting Infinite Possibilities."

As one of the world's leading ICT and AI trade platforms, COMPUTEX 2026 is expected to attract professionals from around the world to Taipei to explore the latest technological innovations and industry trends shaping the AI era.

For more information, please visit:
COMPUTEX Official Website

源自 2022 年推出的 Project STEALTH 組裝套件，率先導入背插設計主機板，提供更便利整線的裝機體驗，同時釋放機殼內空間，讓玩家可盡情展示水冷裝置與風格化設計。技嘉於本次 COMPUTEX 展示搭載背插設計 B850M AORUS STEALTH ICE 主機板與 AORUS GeForce RTX™ 5090 STEALTH ICE 顯示卡，打造純白極簡夢幻主機。除支援自家機殼外，技嘉亦與超過 10 家知名機殼品牌合作，包括 Corsair、LIAN LI、InWin、Montech、Thermaltake、Cooler Master、HYTE 等，為使用者提供市場上最廣泛且最具彈性的相容性選擇。

除了簡約設計的 STEALTH 主機外，技嘉亦同步推出優雅木紋 WOOD 系列，以禪意美學結合天然木紋材質，為電腦硬體注入溫潤優雅的調性，將冰冷科技轉化為兼具質感與居家氛圍的生活風格。為進一步展現 WOOD 系列美學概念，技嘉於 COMPUTEX 2026 與 Noctua 及 TRYX 共同合作，展示以 X870E AERO X3D WOOD 系列主機板打造的木質風格主機，展現細膩工藝與極致效能的完美平衡。

欲體驗簡約 STEALTH 與優雅 WOOD 美學主機，歡迎於 COMPUTEX 2026 期間蒞臨南港展覽館一館 4 樓技嘉消費性產品攤位 #M0520，或前往技嘉官方網站了解更多產品資訊。

GIGABYTE's premium gaming brand, AORUS, takes center stage with the INFINITY Series, a comprehensive lineup of motherboards, graphics cards, peripherals, and chassis. The lineup is led by the flagship X870E AORUS INFINITY NEXT, pushing limits further with aerospace-inspired engineering, featuring an industry-first 3D metal-printed cooling component and space-grade Quad OptiMOS power architecture built for next-generation AI and high-performance computing.

Together with AORUS GeForce RTX™ 50 Series INFINITY graphics cards, the AORUS C510 GLASS INFINITY chassis, and matching peripherals such as the AORUS K10 INFINITY gaming keyboard and AORUS M10 INFINITY gaming mouse, the series reflects GIGABYTE's continued focus on merging engineering performance with elevated PC craftsmanship.

Beyond gaming hardware, GIGABYTE is also showcasing how AI is increasingly becoming part of everyday computing workflows through its expanding AI ecosystem. Across AI TOP, AI BOX, and exclusive AI Agent, GiMATE, on AI gaming laptops, visitors can experience how hardware and software are being optimized together to simplify local AI development, which highlights GIGABYTE's broader vision of making AI more accessible across gaming, creation, and productivity scenarios.

The showcase further highlights how aesthetics is becoming an increasingly important part of PC builds, featuring STEALTH cableless design and the expanded AERO WOOD that brings cleaner builds and more lifestyle-oriented craftsmanship to high-performance PCs. Alongside these designs, a broader lineup of high-performance motherboards, graphics cards, and AORUS ELITE Series gaming monitors, delivering more immersive gaming and visual experiences across the show floor. Please visit ENTER INFINITY at the GIGABYTE Consumer Booth (4F, Booth No. M0520) and Enterprise Booth (1F, Booth No. K0802) during COMPUTEX 2026, and explore more at: COMPUTEX 2026: GIGABYTE & AORUS Press Kit.

GIGABYTE expands the GiMATE experience with new features designed to personalize performance and enhance everyday use. Updates include RGB Fusion 3.0, featuring the new RGB Music Mode that syncs lighting in real time with gameplay or cinematic content; AI Visual, offering scenario-based display presets such as Cinema, Racing/FPS, and E-paper modes; and an enhanced Customize Mode that enables users to balance performance and power efficiency with greater flexibility. Developed with NVIDIA, GiMATE Creator leverages NVIDIA NVFP4 quantization to improve the efficiency of generative AI on RTX™ 50 Series Laptop GPUs, making advanced models faster and more practical to run.

Leading the lineup, the AORUS MASTER 16 represents the COMPUTEX Best Choice Award-winning flagship laptop for extreme performance. Powered by the AMD Ryzen™ 9 9955HX3D Processor and an NVIDIA® GeForce RTX™ 5090 Laptop GPU, it delivers high-end gaming and AI capabilities in an ultra-slim 19mm chassis. The system fully supports the latest GiMATE suite and includes MUX Switch support for more direct GPU control. To help sustain performance under heavy loads, WINDFORCE INFINITY EX cooling supports up to 230W system power for stable, low-noise output during extended sessions.

Also on display are the Red Dot Design Award-winning GIGABYTE AERO X16; Copilot+ PC features an RTX™ 5070 Laptop GPU with 12GB VRAM, designed to enhance AAA gaming image quality with DLSS 4.5 and improve efficiency for superior large language models. The GIGABYTE GAMING A16 PRO targets AI-driven gamers, featuring an RTX™ 5080 Laptop GPU in a sleek 19.45mm chassis with stronger sustained performance. With a 180° lay-flat hinge, it also enables seamless transitions between high-intensity gaming and collaborative work.

Visit GIGABYTE Consumer Booth #M0520 at Nangang Exhibition Center Hall 1, 4F to explore the full laptop lineup. For more information, please visit the official website: URL

台北2026年6月1日 /美通社/ -- GPU 加速儲存與資料保護解決方案領導者圖睿科技（Graid Technology）將於 COMPUTEX 2026 展出全系列 AI-ready RAID 儲存解決方案，涵蓋 GPU 伺服器、企業 AI、AI 資料中心、HPC 叢集、邊緣運算與企業資料中心等多元應用場景。圖睿科技將於 6 月 2 日至 5 日在台北南港展覽館二館 Booth R0502 展示完整產品組合，協助企業突破儲存瓶頸，將儲存轉化為 AI 基礎架構的效能加速器。

隨著 AI 工作負載快速擴展，儲存已不再只是後端基礎設施，而是影響 AI 推論效率、GPU 使用率與整體系統效能的關鍵因素。今年圖睿科技將以 KV Cache Offloading 作為展出主軸，聚焦大型語言模型在長上下文、多輪對話與多使用者推論情境下，對高速資料存取與記憶體管理的迫切需求。

針對不同 AI 部署場景，圖睿科技將展示兩大核心解決方案：SupremeRAID™ AE 與 SupremeRAID™ HE。SupremeRAID™ AE 專為企業 AI 與 GPU 伺服器打造，透過既有 GPU 資源加速 NVMe RAID，提升 AI 推論與 KV Cache 存取效能，並可實現 TTFT 最高 4 倍提升，協助企業以更低延遲回應 AI 應用需求。SupremeRAID™ HE 則面向 AI Data Center 與 HPC 環境，透過高效能、可擴展且具高可用性的 AI 儲存架構，實現 TTFT 約 2 倍提升，加速大規模推論與 KV Cache Offloading 工作流程。

本次 COMPUTEX 2026 的另一大亮點，是 VROC™ by Graid Technology Inc. 的正式亮相。VROC™ by Graid 是專為 Intel^® Xeon^® 平台打造的 CPU-native NVMe RAID 解決方案，進一步擴展圖睿科技在 RAID 儲存領域的產品版圖。透過 VROC™ by Graid，圖睿科技將產品組合延伸至 CPU-native RAID 架構，與既有 SupremeRAID™ GPU RAID 解決方案形成互補，為企業提供涵蓋 CPU 與 GPU 架構、從桌面工作站到資料中心的完整 RAID 儲存選擇。

透過 SupremeRAID™ 全系列與全新 VROC™ by Graid Technology Inc.，圖睿科技將持續推動 RAID 儲存技術創新，為 AI、企業與高效能運算市場打造下一代 storage backbone。

展會資訊
展會：COMPUTEX 2026
日期：2026 年 6 月 2 日至 5 日
地點：台北南港展覽館二館 TaiNEX 2
攤位：R0502

SINGAPORE and TAIPEI, May 19, 2026 /PRNewswire/ -- Z-COM (TWSE: 8176), a Taiwan-based wireless networking company with over 30 years of carrier-grade deployment experience, will exhibit at CommunicAsia 2026 (Booth #3B3-11, Singapore, 20–22 May) and Computex 2026 (Booth K0327A, Taipei, 2–5 June) — two exhibitions that together position Z-COM's edge-native architecture strategy across regional infrastructure and global technology audiences.

CommunicAsia 2026 — Smart Infrastructure for Southeast Asia

Under the theme "AI Infrastructure Starts at the Edge," Z-COM will present its Smart Infrastructure Connectivity Platform — integrating carrier-grade wireless connectivity, centralised management, edge computing, and conversational AI-assisted operations for smart rail, industrial, campus, and government deployments across the region.

The platform includes the NEW Platform edge computing architecture and the zEMS Energy Management System featuring a multilingual generative AI assistant for conversational querying of operational and energy data.

Z-COM's deployments include a 5G smart transit POC at the Danhai Light Rail in Taiwan, smart campus and energy monitoring deployments across Asia, over one million carrier-grade base stations across Asia and Europe, and landmark projects at the 2008 Beijing Olympics and the 2010 Shanghai World Expo. Z-COM is actively seeking SI and distribution partners and welcomes interested organisations to connect at Booth #3B3-11.

"What Southeast Asia's infrastructure projects demand today is a partner who can manage the network, process data at the edge, and run AI applications where reliability is non-negotiable," said Catherine Wu, CEO at Z-COM.

Computex 2026  —  Booth K0327A  •  Taipei Nangang Exhibition Center  •  2–5 June

Computex is where Z-COM brings the same platform story to the global stage. The NEW Platform — Network Extension with Wired and Wireless — is Z-COM's answer to a fundamental shift in how infrastructure is built: away from siloed, cloud-dependent systems, and toward a unified, edge-native architecture where connectivity, management, and AI applications converge into a single operational framework. At Computex, Z-COM will demonstrate what that architecture looks like in practice — from Wi-Fi 7 access points managed through the Cronus controller, to the zEMS Energy Management System operating as an AI-assisted operational layer within the NEW Platform architecture.

"The NEW Platform represents a fundamental rethink of how infrastructure should be built — edge-native, modular, and built to run AI where the data actually lives," said Catherine Wu, CEO at Z-COM. "Computex is where we introduce that vision to the world."

About Z-COM (智捷科技)
Founded in 1995 and listed on the Taiwan OTC market in 2013 (TWSE: 8176), Z-COM is a Hsinchu Science Park-based provider of carrier-grade and enterprise-grade wireless networking and edge computing solutions. With over one million base stations deployed across Asia and Europe, Z-COM serves telecommunications operators, system integrators, enterprises, and public-sector organizations across Asia-Pacific, with deployments spanning smart campus, energy monitoring, industrial, transportation, and government infrastructure. The company holds ISO 9001, ISO 14001, and ISO 27001 certifications and is a member of the Wi-Fi Alliance. www.zcom.com.tw  

Visitors will experience ARBOR's latest innovations across edge AI hardware, rugged embedded computers, vision AI and robotics. Highlights include the award-winning EdgeX-6000 Edge AI HPC Series, recognized as Best in Show at Embedded World 2026, which delivers exceptional AI inference performance for demanding industrial workloads. ARBOR will also feature the AEC-8000, powered by the NVIDIA^® Jetson Thor T5000, purpose-built for next-generation AI-embedded applications in smart manufacturing, logistics, and autonomous systems.

Completing the showcase is the IEC-6700 Edge AI Box PC featuring Intel's latest Panther Lake processors and enhanced AI computing capabilities. Additional solutions include the ARES-1983H-AI series with flexible M.2 AI accelerator expansion for scalable Edge AI deployment, as well as the ARTS-7670, an IP69K-rated waterproof fanless computer specifically engineered for harsh industrial and outdoor operating conditions.

Aligned with the "AI Together" theme at COMPUTEX 2026, ARBOR highlights its commitment to advancing Edge AI innovation with rugged, scalable, and AI-ready platforms that bridge edge computing and intelligent action.

Unlock the power of real-time intelligence at the edge. Click here to explore our Edge AI highlights and plan your visit to our Computex 2026 showcase.

Architecture Meets Industrial Edge Demands

The shift toward edge AI in factory automation, smart cities, and defect inspection heightens the demand for power-efficient inference. For battery-powered AMRs and AGVs, minimizing power consumption is critical to sustaining operational endurance and lowering thermal costs—positioning this high-performance, low-power architecture as a compelling choice for next-generation deployments.

With Dragonwing, Qualcomm Technologies aims to deliver industry-leading power efficiency and multimodal compute to the industrial segment. Spanning the Qualcomm Dragonwing™ IQ8, IQ9, IQ10, and IQ-X Series with product longevity support through 2036 or later, this scalable processor portfolio helps enable enterprises to right-size compute infrastructure. Capitalizing on this, Innodisk unleashes this potential by providing a "AI on Dragonwing" hardware lineup of modules, starter kits, and deployment-ready systems, paired with its IQ Studio software toolkit streamlines evaluation-to-deployment with BSP, benchmarking, and model optimization.

"Dragonwing processors aim to deliver industry-leading performance-per-watt with long-term supply commitment, helping to establish a solid foundation for physical AI deployment at scale," said Shyam Krishnamurthy, SVP, Product Management, Qualcomm Technologies, Inc. "Innodisk's industrial edge integration expertise makes them a critical partner in bringing the AI on Dragonwing ecosystem to market."

Scalable Compute Across Four Performance Profiles

The Computex lineup covers four Dragonwing™ platforms spanning distinct application profiles.

The Dragonwing IQ8 Series powers the EXMP-Q801 COM-HPC Mini module, designed to deliver up to 40 TOPS (Dense) with wide-temperature operation for vision inference and sensor fusion.

The Dragonwing IQ9 Series is designed to scale up to 100 TOPS (Dense) via dual NPU and powers the EXMP-Q911 module, EXEC-Q911 starter kit, and the APEX-A100 fanless edge AI system, helping to address industrial inspection, Driver Monitoring Systems (DMS), and multi-stream analytics.

The Dragonwing IQ10 Series, powering the EXMR-QA01, aims to extend the portfolio to a massive 350 TOPS (Dense). Featuring an 18-core Oryon™ CPU, support for up to 20 MIPI cameras at 16 MP, and an integrated Safety Island (SAIL) module, the platform is custom-engineered to help support heavy-duty AMR navigation, humanoid robotics, and VLM and VLA edge workloads.

The Dragonwing IQ-X Series stands out with native Windows compatibility. The EXDU-QX11 edge AI system, powered by the Dragonwing IQ-X processor, is designed to deliver up to 45 TOPS with native Windows compatibility. Offering dual-OS support for Windows 11 IoT Enterprise LTSC and Ubuntu 26 LTS, it is designed to streamline deployment in PLCs, HMIs, and edge controllers equipped with features such as Ethernet, MIPI CSI, and CAN.

Live Demonstrations at Computex 2026

At the Innodisk booth, two live demonstrations validate deployment readiness. The first, showcasing the EXMP-Q911 module powered by the Dragonwing IQ9 processor, executes a concurrent pipeline of CNN defect inspection, DMS, and VLM-driven PPE detection within a strict 30W total system power. The system achieves an ultra-low 4.4 ms average inference latency, delivering a 2.6× speed advantage over traditional architectures while optimizing performance-per-watt.

The second demo showcases vision-powered autonomous robotic navigation on the EXFC-Q911 fanless system. Engineered for AMRs and AGVs, the system manages a high-throughput 8-channel GMSL2 camera pipeline and 3D depth sensors, delivering 360-degree spatial awareness and real-time obstacle avoidance with millisecond-level responsiveness at only 32W.