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RIYADH, Saudi Arabia, Oct. 14, 2025 /PRNewswire/ -- At the Solar & Storage Live KSA 2025, Gotion High-Tech(SHE:002074) globally debuted two key innovations: the All-Scenario Zero-Carbon Solution and the GOTION GRID Q 20MWh BESS. Designed for scalable and replicable zero-carbon applications, these highlight Gotion's commitment to delivering integrated green energy solutions for the Middle East, advancing Saudi Vision 2030. Gotion also showcased new storage products, including the GOTION EDGE X commercial and industrial system. Gotion's All-Scenario Zero-Carbon Solution targets Saudi Arabia's transition "from single-scenario deployment to future city-scale applications," including Zero-carbon Park, Heavy Industry, Transportation, Home, Cultural Tourism and Factory. Based on two pillars, the solution achieves carbon reduction, efficiency improvements and cost optimization. Powered by a Digital Energy Platform—the system's "intelligent brain"—The solution connects energy generation, consumption and management, enabling customized decarbonization across multiple scenarios. The platform also supports value-added services such as electricity trading, operation hosting and carbon management, while offering end-to-end control, ensuring long lifespan, high safety, and high efficiency operation. The GOTION GRID Q 20MWh BESS serves as the company's dual-engine flagship product for large-scale storage. Its modular design delivers four times the capacity of traditional 5MWh systems, cutting costs by 20% and deployment time by 50%. A hybrid air-liquid cooling system improves energy efficiency by 20%, achieving a 25-year lifespan matching photovoltaic systems. Tailored for Middle Eastern grids and solar energy projects, the system sets a new benchmark for ultra-large energy storage, featuring 400 kWh/m2 energy density with multiple international certifications. Backed by its zero-carbon practices, Gotion continues to expand its global green footprint. Several factories in China have achieved zero-carbon certifications through Solar energy plus energy storage (PV+ESS) systems, waste heat recovery, and green logistics. The Xinzhan plant was recognized as a "Model Carbon-Neutral Factory in Lithium Battery Industry". Its zero-carbon anode material plant in Inner Mongolia is powered entirely by renewable electricity with a 1GW solar plant, which will reduce 1.097 million tons of CO2 equivalent annually, proving zero carbon factory is an achievable reality. As recognized by Bloomberg NEF (BNEF) and S&P Global as a Tier1 clean energy leader, Gotion High-Tech strives to be not only a provider of innovative green solutions, but also a strategic partner in the Middle East's energy transition.
Attendees of Global Mayors Dialogue highlight heritage conservation DUNHUANG, China, Oct. 14, 2025 /PRNewswire/ -- A news report from chinadaily.com.cn: Dunhuang, Gansu province, was once a hub where Eastern and Western civilizations met on the ancient Silk Road — with the Mogao Grottoes as a living witness, boasting vibrant Buddhist murals and sculptures. Guests engage in discussions on the opportunities and challenges of cultural urban governance during the main dialogue session of the "Global Mayors Dialogue · Dunhuang" in Dunhuang, Gansu province, Oct 13, 2025. [Photo by Chen Zebing/chinadaily.com.cn] Today, it still uses its cultural heritage to help cities of diverse cultural backgrounds understand and collaborate with one another, as participants at a dialogue agreed on Monday. The 2025 "Global Mayors Dialogue • Dunhuang" was held in Dunhuang from Saturday to Monday, with guests participating in cultural experiences in the city during the first two days. The official opening ceremony kicked off on Monday, under the theme "A Symphony of Civilizations, Resonance in Harmony", aiming to implement the Global Civilization Initiative and build a more effective international communication system. The event welcomed 200 attendees, both from China and abroad, including 23 international representatives from government delegations and cultural institutions across nine countries. "Over the years, we have developed a set of core conservation technologies to protect ancient murals, sculptures and grotto temples. These practices can not only be applied to the conservation of the Mogao Grottoes, but also provide valuable experiences for other countries," said Su Bomin, director of the Dunhuang Academy. The academy's cultural heritage conservation pattern has been promoted and applied in many key cultural heritage sites across China. He added that the next plan is to expand such efforts to the protection of cultural relics in Belt and Road countries, including Kyrgyzstan. During the ceremony, Dunhuang officials signed letters of intent on establishing sister-city relations with Garni, Kotayk province, Armenia, as well as friendly exchange city relations with Manisa city, Turkiye. "Both cities share a commitment to protecting cultural heritage. I'm impressed how Dunhuang promotes its deep culture via cultural and creative products and intangible cultural heritage," said Burak Deste, general secretary of Manisa Metropolitan Municipality. He shared the city's experiences and vision on the preservation of cultural heritage and expressed hope that more people from both nations will visit each other's countries to explore magnificent historical sites and gain a deeper understanding of each other's culture and history. Dunhuang officials also signed a memorandum on further enhancing friendly relations with Venice, Italy. "The two cities will cooperate in various fields, including cultural heritage conservation, commerce, and education," said Massimo Andreoli, chairman of the Venice Carnival and artistic director of the carnival's opening ceremony. He believed that for cities like Dunhuang and Venice with rich cultural heritage, the challenge lies in striking a proper balance between tradition and innovation. Tradition refers to the preservation of traditional manufacturing, while innovation means leveraging the opportunities offered by new communication and promotional tools including artificial intelligence. "Cities across the globe share common challenges such as environmental protection. It's important to have such a dialogue for participants from different countries to share our views," he said. He noted that Dunhuang was a symbolic place to host the event, just as it once served as a strategic gateway for cross-cultural exchange along the ancient Silk Road. "It's necessary to have such international cultural exchange, as it facilitates vibrant interactions among different civilizations, making this a mutually beneficial endeavor," said Steven Back, representative of the Hungarian National Museum in China. He noted that the Digital Dunhuang project enables both Chinese and international scholars to better understand and learn more about Dunhuang.
TAIPEI, Oct. 14, 2025 /PRNewswire/ -- InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm UCIe high-speed interface technology demo, featuring support for the newest UCIe 3.0 standard, 3D packaging integration, and ultra-high-speed, low-power performance. This demonstration highlights InPsytech's advanced R&D capabilities in Chiplet interconnect technology and its role in supporting Egis Group's broader strategy in semiconductor design and heterogeneous integration. Industry-Leading 3nm 64G UCIe Technology — High Speed, Low Power, Full UCIe 3.0 Support InPsytech has long focused on high-speed and low-power interface IP technologies. Its UCIe (Universal Chiplet Interconnect Express) portfolio supports advanced process nodes from 22nm down to 2nm, optimized for 3nm production. The IP achieves data transfer rates up to 64 GT/s, while supporting 2.5D and 3D packaging architectures to enable high-efficiency chip-to-chip interconnects and heterogeneous integration. The showcased 3nm UCIe 3.0 demo fully complies with the latest UCIe 3.0 specification, demonstrating InPsytech's leadership in next-generation process technology and Chiplet ecosystem development. Collaborating with Alcor Micro to Advance the Arm Chiplet Ecosystem InPsytech's UCIe technology has been successfully adopted in Alcor Micro Corp.'s latest Arm-based CPU platform Mobius100 (CSS V3), which will also be featured at the OCP 2025 Summit. The platform is built on Arm Neoverse CSS architecture, supporting CPU die-to-die interconnects and flexible integration with GPUs, NPUs, and various AI accelerators — driving advancements in heterogeneous computing and Chiplet design. Both InPsytech and Alcor Micro are members of the Arm Total Design (ATD) program, jointly fostering collaboration and innovation across the Arm Chiplet ecosystem. "We are proud to demonstrate our leadership in this field alongside Alcor Micro," said David Hsu, COO of InPsytech. "We have strong confidence in the future of UCIe within the Arm Chiplet ecosystem and believe that InPsytech's UCIe technology will accelerate Chiplet adoption, bringing new innovation and breakthroughs to the global semiconductor industry." Exhibition Details Event: OCP Global Summit 2025Date: October 13–16, 2025Location: San Jose Convention Center, California, USAExhibit Zone: Innovation Village ZoneShowcase: 3nm UCIe 3.0 Demo (with 3D Package Support)Partner: Alcor Micro Corp.
SAN JOSE, Calif., Oct. 14, 2025 /PRNewswire/ -- Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, unveiled its double-wide rack architecture to address the industry shift toward larger, higher‑power AI chips at the OCP Global Summit 2025 (Booth B13, San Jose Convention Center). The architecture brings together an HVDC power rack and busbar, advanced liquid cooling, and a signal‑integrity‑optimized compute/switch layout to tackle data transmission, power delivery, thermal, and mechanical challenges in high‑density computing—propelling the future of AI and turning ideas into impact. Key innovations on display Double-Wide Rack: Doubles the width of traditional rack to accommodate growing chip/module footprints as compute demand rises. The double‑wide compute tray places four large AI accelerators side by side, supporting chips scaling to 9.5‑reticle with 12× HBM and substrates up to 120 × 150 mm. The design preserves on‑board high‑speed interconnects and signal integrity while reducing cable routing and signal loss. It is co‑designed with the switch tray configuration to ensure high‑speed signal quality in scale‑up scenarios. The compute and switch trays use an advanced mechanical design with a reinforced chassis to prevent sagging.The new architecture is engineered to accommodate next-generation accelerators such as AMD Instinct™ MI400 Series GPUs, enabling rack scale performance for frontier AI training and inference. HVDC power: To meet surging rack‑level power density, the architecture adopts HVDC power delivery. A HVDC power rack converts AC to ±400/800 VDC and distributes it to IT racks next to it via vertical and horizontal busbars and connectors, significantly reducing distribution losses while boosting energy efficiency and scalability. With ecosystem partners, Wiwynn offers ±400/800 VDC and 50 VDC busbar options and the required power delivery boards (PDBs) to flexibly support data center needs. Liquid‑cooled Busbar: Engineered for high‑current busbars, integrating liquid cooling to control temperature and reliability, improving safety and stability. Supports Wiwynn's in-house design with flexible inlet/outlet configurations to fit diverse data center liquid‑cooling loops, while also supporting multi‑vendor solutions. Advanced Liquid Cooling Solutions: Targeting 4 kW class chip thermal capability, the portfolio includes high‑efficiency cold plates, AALC, in‑row CDUs, and liquid‑cooling management. It balances reliability, serviceability, and scalability to deliver efficient, sustainable cooling for AI/HPC workloads. "AI is rapidly entering an era of higher power and larger package footprints. Meeting fast‑evolving compute‑density demands requires out‑of‑the‑box thinking," said William Lin, President and CEO at Wiwynn. "Our double‑wide rack breaks traditional limits, delivering rack‑level optimization across compute and signal integrity while uniting HVDC power and liquid‑cooling technologies to build the efficient, scalable, and sustainable infrastructure needed for next‑generation AI. We look forward to partnering with OCP ecosystem partners to bring these designs into practical deployments. Visit Wiwynn @OCP 2025 (Booth B13, San Jose Convention Center ) , join our engineering workshop sessions and download our latest whitepapers to explore the latest innovations shaping the future of AI infrastructure and data center technologies. About Wiwynn Wiwynn is an innovative cloud IT infrastructure provider of high‑quality computing and storage products, plus rack solutions for leading data centers. We are committed to the vision of "unleash the power of digitalization; ignite the innovation of sustainability." The company aggressively invests in next‑generation technologies to provide the best TCO, workload, and energy‑optimized IT solutions from cloud to edge. For more information, please visit Wiwynn website, Facebook, and Linkedin.
SAN JOSE, Oct. 14, 2025 /PRNewswire/ -- Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, is showcasing its next-generation AI servers, developed in collaboration with Wistron, and advanced direct liquid cooling (DLC) solutions at OCP Global Summit 2025 (Booth B13, San Jose Convention Center). "At OCP Global Summit, we're proud to demonstrate our latest accelerated solutions and cooling innovations," said William Lin, President and CEO at Wiwynn. "Together with industry leaders, we're advancing the frontiers of AI computing performance and thermal efficiency. These collaborations enable a comprehensive suite of cutting-edge products that address the surging needs of both modern and legacy data centers in the AI era." Next-Generation AI Systems NVIDIA GB300 NVL72: Wiwynn and Wistron are among the first to be offering NVIDIA GB300 NVL72 systems. This liquid-cooled, rack-level AI system is built on 72 NVIDIA Blackwell Ultra GPUs and features NVIDIA ConnectX-8 800Gb/s SuperNICs, delivering unprecedented AI factory output for reasoning model inference, leading the next wave of accelerated computing. NVIDIA HGX B300: The cutting-edge 10U system is built with eight NVIDIA Blackwell Ultra GPUs. Featuring 2.1TB of HBM3e memory and NVIDIA ConnectX-8 800Gb/s SuperNICs, the NVIDIA HGX B300 system delivers breakthrough performance for demanding AI workloads. AMD Instinct™ MI350 Series GPUs and platforms: Powered by AMD Instinct™ MI350 series (AMD CDNA™ 4) and built on a platform featuring EPYC™ CPUs and an AMD Pollara 400 AI Network Interface Card, the system delivers up to 35x improvement in inference performance compared to its prior generation. Double-Wide Rack Architecture: Doubles traditional rack width to support larger, higher‑power AI chips, integrating HVDC power, advanced liquid cooling, and signal‑integrity‑optimized layouts to address data, power and thermal challenges in high‑density computing. The new architecture is engineered to accommodate next-generation accelerators such as AMD Instinct™ MI400 Series GPUs, enabling rack scale performance for frontier AI training and inference. (More Details about the Architecture) Advanced cooling innovations Double-side Cold Plate: Designed for future high‑power ICs, Wiwynn's double‑sided cold plate supports up to 4 kW thermal capability for the primary AI-accelerator and essential vertical power‑delivery ICs concurrently. Leveraging Wiwynn's proprietary microchannel designs and electrochemical 3D-printing technology, it is expected to provide up to a 40% improvement in thermal performance. Two-phase Cold Plate: Designed for two-phase liquid cooling systems using dielectric, eco-friendly refrigerants, Wiwynn's patented 3D‑printed wicking‑fin cold plate design harnesses phase change to boost heat transfer and reduce leakage‑related downtime—delivering a high‑efficiency, high‑reliability solution for large‑scale liquid‑cooled AI/HPC. 300 kW AALC Sidecar: Developed with Shinwa Controls Co.,Ltd., the double-rack-width solution, further boosts AALC (Air-Assisted Liquid Cooling) capability with high reliability and serviceability, enabling liquid-cooled AI racks in air-cooled data centers without infrastructure changes. Future Technologies Symposium preview: Wiwynn and Fabric8Labs will present "Next-generation cold plate with electrochemical 3D-printed microchannels for Ultra-high heat fluxes beyond 350W/cm²" , detailing how advanced thermal technologies and IC package co‑design significantly enhance the cold plate thermal capability for liquid cooling system. Cutting-edge Networking Solutions NVIDIA Spectrum-X: The companies are showcasing NVIDIA Spectrum-X Ethernet for AI networking, building upon NVIDIA Spectrum-4 MAC technology. This platform integrates SONiC and NVIDIA Cumulus to deliver advanced Ethernet connectivity for multi-tenant, hyperscale AI clouds, enabling flexible datacenter deployment scenarios. Broadcom Tomahawk 6: The revolutionary 102T datacenter switch adopted the latest Broadcom Ethernet Switch, supporting 1.6Tbps x 64 ports in a 4RU air-cooled system designated for modern datacenter. Visit Wiwynn @OCP 2025 (Booth B13, San Jose Convention Center ) , join our engineering workshop sessions and download our latest whitepapers to explore the latest innovations shaping the future of AI infrastructure and data center technologies. About Wiwynn Wiwynn is an innovative cloud IT infrastructure provider of high-quality computing and storage products, plus rack solutions for leading data centers. We are committed to the vision of "unleash the power of digitalization; ignite the innovation of sustainability". The company aggressively invests in next-generation technologies to provide the best TCO (Total Cost of Ownership), workload, and energy-optimized IT solutions from cloud to edge. For more information, please visit Wiwynn website, Facebook, and Linkedin.
SAN JOSE, Calif., Oct. 14, 2025 /PRNewswire/ -- As AI compute demand continues to surge and data center energy consumption reaches new highs, balancing performance, cost, and sustainability has become a core challenge for cloud providers and enterprises. Compal Electronics (Compal; Ticker: 2324.TW), a pioneer in high-performance AI server platforms, announced that it will present its latest data center technology blueprint at OCP Global Summit 2025, showcasing innovations that span AI strategic collaboration, CXL-based memory solutions, and advanced liquid cooling, underscoring its comprehensive vision for future infrastructure. Compal Redefines AI-Driven Data Centers with CXL and Liquid Cooling Innovations at the 2025 OCP Global Summit In recent years, the server market has shifted beyond raw compute performance, placing increasing emphasis on energy efficiency and scalability. Compal continues to deepen its collaboration with NVIDIA, addressing enterprise requirements for high performance, flexibility, and efficiency, helping accelerate AI factory and inference platform deployment, and shortening time-to-market. "AI has moved beyond proof-of-concept to become a central pillar of enterprise digital transformation. Our collaboration with NVIDIA focuses on integrating compute, networking, and cooling technologies to help customers build scalable and sustainable AI infrastructure. We warmly invite attendees to visit us at OCP25 and experience our latest AI platform demonstration accelerated by NVIDIA," said Alan Chang, Vice President of the Infrastructure Solutions Business Group at Compal. The showcase will also feature PCIe-based memory pooling technology built on CXL (Compute Express Link) and RDMA (Remote Direct Memory Access) architectures, demonstrating next-generation data center innovations in memory expansion, dynamic resource allocation, and low-latency interconnects. By leveraging advanced interconnect technologies such as PCIe Gen5 (Peripheral Component Interconnect Express, Generation 5), NVMe-oF (Non-Volatile Memory Express over Fabrics), and CXL Fabric, the solution enables high-bandwidth data exchange and resource pooling across server nodes. This architecture further integrates memory and storage tiers, driving the realization of the Storage-as-Memory concept, allowing data to be accessed at near main-memory speed while enhancing overall system performance, scalability, and efficiency. The on-site demonstration will highlight multi-terabyte memory pooling capabilities and cache-coherency technologies, offering attendees a firsthand look at how these innovations enable a more efficient, flexible, and energy-optimized AI data center infrastructure. To tackle the thermal demands of high-performance GPUs, Compal will unveil two innovative liquid cooling servers at the OCP Global Summit 2025: the OG720-2A-L2 ORv3 7OU 8x AMD Instinct™ GPUs Direct-to-Chip Liquid-Cooled AI Server and the SG223-2A-I 2U 8x GPU Immersion Cooling Server. These demonstrations will highlight how both solutions sustain optimal performance and energy efficiency under maximum load, enabling data centers to achieve a partial Power Usage Effectiveness (pPUE) below 1.1. The systems provide a scalable and efficient framework for next-generation high-density AI and HPC deployments. OCP Global Summit 2025 will take place in San Jose Convention Center, California, USA. Visitors to Compal's Booth C35 will gain insight into how AI, CXL, and advanced liquid cooling technologies are shaping the next decade of data centers — and will have the opportunity to engage directly with Compal's engineering team to discuss optimal solutions for performance, efficiency, and cost. About CompalFounded in 1984, Compal is a leading manufacturer in the notebook and smart device industry, creating brand value in collaboration with various sectors. Its groundbreaking product designs have received numerous international awards. In 2025, Compal was recognized by CommonWealth Magazine as one of Taiwan's top 7 manufacturers and has consistently ranked among the Forbes Global 2000 companies. In recent years, Compal has actively developed emerging businesses, including cloud servers, auto electronics, and smart medical, leveraging its integrated hardware and software R&D and manufacturing capabilities to create relevant solutions. More information, please visit https://www.compal.com Media ContactJack Wang Vice president and Spokesperson +886-2-8797-8588 Investor@compal.com
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